目的 研究 pH 值以及表面活性剂种类对 CMP 抛光液稳定性及抛光性能的影响。 方法 向硅溶胶中加入酸性或碱性 pH 值调节剂,配制不同 pH 值的 CMP 抛光液;通过添加不同类型的表面活性剂,研究表面活性剂对抛光液的稳定机理。 结果 硅溶胶 CMP 抛光液 pH 值为 9 . 5 时,加入非离子表面活性剂,抛光 90 min 后,铝合金表面粗糙度降低了 55 . 4% ,光亮度增加了 131% ,抛光质量较好。 结论 弱碱环境下,抛光液的稳定性和抛光性能优良,非离子表面活性剂有利于 CMP 抛光液的稳定性。

Objective On the basis of preparing silicon sol polishing liquid for CMP process, the effects of pH value and surfactants on the reliability and properties of CMP slurry were studied. Methods Different pH values of CMP polishing liquid were configured through adding acidic or alkaline pH adjusting agent into the polishing liquid. The stabilizing mechanism of surfactants on the polishing solution was studied. Results When the pH of CMP solution was 9. 5, and Non-ionic surfactant was added, after 90 min, the surface roughness of polished aluminum alloy was decreased by 55. 4% , and the brightness was increased by 131% . The polishing quality of aluminum alloy surface was good. Conclusion Research showed the excellent stability and polishing performance of the polishing solution in weakly alkaline condition. Non-ionic surfactants were beneficial to the stability of CMP polishing liquid.