以化学镀镍反应机理为依据,针对一种酸性化学镀镍体系,就主盐浓度( 硫酸镍) 、还原剂( 次磷酸钠) 、pH 值、 温度等因素对施镀过程中镀液稳定性的影响进行了分析。 结果表明: 在 Ni²⁺质量浓度 5 . 8 g / L、H₂PO₂-质量浓度 17 . 4 g / L、pH 值 4 . 4 、温度 82 ℃ 的条件下施镀,化学镀镍施镀过程稳定性最佳。

Based on the action mechanism of electroless nickel deposition, the factors affecting the stability of the plating solution, such as salinity ( nickelous sulfate and sodium hypophosphite ) , pH value, temperature and operating methods were analyzed. It is indicated that when the concentration of Nickel and hypophosphite acid is 5 . 8 g / L and 17 . 4 g / L respectively, and pH value is 4 . 4 , the best plating stability can be achieved under 82 ℃ .