以氯化亚金和硫氰酸盐为原料,采用“ 选择性还原-络合冶 的方法首次合成了“ 金-硫氰酸根冶 配合物,并通过元素分析确定其分子式为 NH₄[ Au( SCN)₂] 。 按 PCB 行业的相关工艺要求,对该配合物的化学镀金性能进行了探讨,得到最佳沉金工艺条件为: pH 值 2 ~ 5 , 金质量浓度 1 ~ 3 g / L, 温度 40 ~ 60 ℃ , 施镀时间 9 ~ 12min。 在此条件下所得的沉金层厚度可达 0 . 12 μm,满足相关行业的品质要求。

We used aurous chloride and thiocyanate as raw materials, with method of " Selective reduction-complexation" , for the synthesis of " Au-thiocyanate" complex, and determined its molecular formula-NH₄[ Au ( SCN)₂] by elemental analysis. According to the relevant technology of PCB industry, chemical plating properties of the complexes were discussed, and we got the best process condition: pH = 2 ~ 5 , aurous concentration 1 ~ 3 g / L, temperature 40 ~ 60 ℃ , plating time 9 ~ 12min, respectively. Under this condition resulting gold layer thickness of 0 . 12 μm, which can meet the quality requirement of the related industries.