目的 针对大尺寸单晶金刚石表面加工质量难的问题,本研究采用外延生长结合抛光工艺,探讨抛光液组分和抛光时间对英寸级单晶金刚石表面形貌及粗糙度的影响,旨在实现亚纳米级加工表面。方法 通过微波等离子体化学气相沉积法(MPCVD)制备英寸级单晶金刚石,利用共聚焦拉曼光谱(Raman)和高分辨X射线衍射(HRXRD)表征晶体质量。采用紫外光辅助化学机械抛光法(UV-CMP),分别在含Fenton试剂、H2O2和仅含H2O2的抛光液下抛光。通过原子力显微镜(AFM)分析表面粗糙度和材料去除率,并利用傅里叶变换红外光谱仪(FTIR)测试抛光前后的红外光学透过率。结果 通过400 h生长获得了尺寸为17 mm×17 mm×1.2 mm的高质量单晶金刚石,拉曼峰半高宽低至2.16 cm‒1;UV-CMP结果显示,含Fenton试剂的抛光液的Fe2+催化产生的羟基自由基(∙OH)生成速率过快,与金刚石表面碳原子去除速率不匹配,不利于表面平滑化,而单一H2O2抛光液则可实现粗糙度低至0.40 nm的亚纳米级光滑表面。红外透过率测试揭示了金刚石在10.6 µm处的平均红外透过率由68.8%提升到72.4%。结论 采用MPCVD法获得英寸级高质量单晶金刚石,通过抛光液组分调控金刚石抛光后的表面粗糙度,进而提升其红外光学透过率,该工作为大尺寸单晶金刚石的高质量表面加工及应用提供了工艺参考。
Abstract
The large single-crystal diamond with high surface quality is a key material for advanced applications such as deep-UV optoelectronic devices, high-power laser windows, heat-dissipation substrates, and quantum technologies. However, its extreme hardness and high chemical stability make it challenging to achieve ultra-smooth, sub-nanometer-level surfaces without inducing subsurface damage. Traditional mechanical polishing inevitably introduces deep subsurface damage such as microcracks and dislocations, severely compromising device performance and reliability. Meanwhile, non-contact techniques like plasma etching, while avoiding mechanical damage, struggle to simultaneously achieve exceptional surface flatness and atomic-level roughness requirements across large dimensions. These process bottlenecks significantly hinder the industrial-scale mass production of inch-sized single-crystal diamond wafers. To overcome this bottleneck, the work aims to develop an integrated approach that combines microwave plasma chemical vapor deposition (MPCVD) with ultraviolet-assisted chemical mechanical polishing (UV-CMP), so as to realize sub-nanometer flat surface of the inch-scale single-crystal diamond. The high-quality single-crystal diamond with a size of 17 mm × 17 mm and a thickness of 1.2 mm was grown by MPCVD for 400 h. Raman spectroscopy and high-resolution X-ray diffraction (HRXRD) confirmed its excellent crystalline quality, with a Raman peak full width at half maxima (FWHM) of 2.16 cm-1 and a (004) diffraction FWHM of 90.75 arcsec (1 arcsec=(1/3 600)°), indicating low dislocation density and high lattice integrity. Subsequently, UV-CMP experiments were carried out with two types of SiO2-based slurries: one containing Fenton's reagent (Fe2+/H2O2) and another containing only H2O2. The effect of slurry composition and UV irradiation on the polishing rate and surface morphology was systematically investigated. The Fe2+-containing slurry produced large amounts of hydroxyl radicals (·OH) under UV illumination but suffered from rapid Fe2+ depletion, leading to a mismatch between oxidation and material removal rates. This imbalance caused unstable polishing and limited surface roughness improvement. In contrast, the Fe2+-free slurry maintained continuous hydroxyl radicals (·OH) generation through photoactivation of H2O2 under 365 nm UV light, ensuring a stable chemical-mechanical interaction. The sustained oxidation and gentle removal of surface carbon atoms established a balanced mechanism of "oxidation-softening-removal", enabling uniform polishing while avoiding subsurface damage. Atomic force microscopy (AFM) measurements revealed that after UV-CMP with the Fe²+-free slurry, the root-mean-square (RMS) surface roughness decreased to 0.40 nm within a 20 μm × 20 μm scan area, reaching sub-nanometer ultra-smoothness. Fourier transform infrared (FTIR) spectroscopy showed that the average infrared transmittance at 10.6 μm increased from 68.8% to 72.4% after polishing, approaching the intrinsic transmittance of type IIa diamond (72.7%). The enhancement of optical transmittance was attributed to the significant reduction in surface roughness scattering and the preservation of high crystalline integrity during polishing. In summary, this study demonstrates that the combination of MPCVD epitaxial growth and UV-assisted CMP provides an effective route for achieving high-quality, ultra-smooth surfaces on inch-scale single-crystal diamond. The optimized Fe2+-free slurry enables sustainable radical generation, high polishing efficiency, and superior optical performance. This approach offers a practical and scalable solution for surface planarization and optical enhancement of the large single-crystal diamond, supporting its future applications in high-power laser systems, DUV photonic chips, and quantum thermal management devices.
关键词
单晶金刚石 /
化学机械抛光 /
大尺寸 /
亚纳米表面 /
红外透过
Key words
single-crystal diamond /
chemical mechanical polishing /
large-size /
sub-nanometer surface /
infrared transmission
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基金
国家重点研发计划(2024YFB3816600); 中国科学院科学仪器开发项目(PTYQ2024YZ0007)