目的 探究钛合金TC4挤出带材晶体织构形成规律以及带材晶体织构变化对其耐磨性的影响。方法 利用挤出切削有限元仿真和黏塑性自洽(VPSC)模型,实现不同切削厚度压缩比条件下TC4带材织构预测,并通过纳米划痕实验分析不同织构类型带材的耐磨性。结果 挤出切削带材呈现较均匀的变形,剪切应变高达2时,带材细化拉长晶粒尺寸为1~3 μm。钛合金带材晶体织构表现为3类,{11‒20}<0001>、倾斜的{11‒20}<0001>和{10‒10}<11‒20>板织构。VPSC仿真结果表明,在高应变率(5.89×104 s-1)下基面滑移系和二阶<c+a>锥面滑移系启动对{11‒20}<0001>织构的形成占主导地位。大应变条件下(剪应变≥2)一阶<c+a>锥面滑移系和二阶<c+a>锥面滑移系启动对倾斜的{11‒20}<0001>织构形成影响较大。纳米划痕测试表明,刻划面为{11‒20}晶面的带材耐磨性优于{10‒10}晶面的带材。结论 挤出应变对带材晶粒细化程度以及晶粒细化均匀性影响较大,各滑移系相对活性是影响TC4带材晶粒织构形成的微观因素,这对通过控制挤出加工参数制备钛合金带材具有一定指导意义。带材晶体织构表现为易于滑移变形的晶面其耐磨性较差,直观展示了钛合金带材晶体织构与耐磨性的对应关系。
Abstract
Large strain extrusion machining (LSEM) can realize the creation of ultra-fine grained chip foil, and change the crystallographic texture type of chip foil. The ultra-fine grained chip foil used in the micro-electro-mechanical system can improve its overall performance significantly, especially the ultra-fine grained chip foil with special crystallographic textures. The mechanical properties, corrosion resistance, wear resistance, etc. are closely related to the material crystallographic texture. Therefore, it is vital to explore the influences of chip foil crystallographic textures on its performances. In this study, the extrusion machining of titanium alloy Ti-6Al-4V is taken as the research object, the formation and evolution of crystallographic textures of chip foil and thus its influences on wear resistance are explored to realize the control of crystallographic textures of ultra-fine grained chip foil. A coupled finite element simulation and visco plastic self-consistent (VPSC) model was employed to predict crystallographic textures for Ti-6Al-4V foil under different cutting thickness compression ratios. The slip systems of Ti-6Al-4V activated in the LSEM are analyzed to show the internal formation mechanism of different crystallographic textures for chip foil. Meanwhile, the wear resistance of different texture types of chip foil is analyzed by nano scratch test. The results show that the extrusion machining chip foil presents relatively uniform deformation. The elongated grains in chip foil are refined to 1-3 μm when the shear strain is about 2. With the increase of the chip thickness ratio, large grains and fine equiaxed grains are coexisted in the chip foil because the extrusion strain is decreased. Three crystallographic textures of titanium alloy chip foil are included, {11‒20}<0001>, inclined {11‒20}<0001>and {10‒10}<11‒20> matrix textures. VPSC simulation results show that at a high strain rate (5.89×104 s-1), the activations of basal slip system and second-order pyramidal <c+a> slip system dominate the formation of the {11‒20}<0001>texture. Under the condition of large strain (shear strain≥2), the activation of the first-order <c+a> pyramidal slip system and the second-order <c+a> pyramidal slip system have large influences on the formation of the inclined {11‒20}<0001> texture. Nano scratch tests show that the wear resistance of chip foil with a {11‒20} crystal plane is better than that of the chip foil with a {10‒10} crystal plane, and the wear resistance of chip foil with a crystal plane of easy slip deformation is poor. The extrusion strain has a great influence on the grain refinement degree and grain refinement uniformity of the chip foil. The relative activity of each slip system during LSEM is the microscopic factor which affects the formation of the crystallographic texture for Ti-6Al-4V chip foil. It provides some guidance for the preparation of titanium alloy chip foil by controlling extrusion machining parameters. The crystallographic texture of chip foil exhibits poor wear resistance due to the easy slip deformation of the crystal plane, which intuitively demonstrates the corresponding relationship between the crystallographic texture and wear resistance of titanium alloy chip foil.
关键词
大应变挤出切削 /
钛合金超细晶带材 /
晶体织构 /
黏塑性自洽模型 /
耐磨性
Key words
large strain extrusion machining /
titanium alloy ultra-fine grained foil /
crystallographic texture /
viscoplastic self-consistent model /
wear resistance
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基金
国家自然科学基金资助项目(52105494)