目的 解决传统天线制造工艺普遍存在着周期长、成本高、镀层易脱落等问题。方法 采用激光表面处理（Laser Surface Treatment,LST）技术对FR-4介质基板进行选区粗化,并结合化学镀技术制备天线金属层。运用扫描电子显微镜（Scanning Electron Microscope,SEM）,扫描探针显微镜（Scanning Probe Microscope, SPM）,共聚焦激光显微镜（Confocal Laser Scanning Microscope, CLSM）,分析了介质基板在激光表面处理前后的显微结构和面粗糙度。并结合实验探讨了不同激光参数下,不同形貌下镀层临界载荷的变化,最后基于Box-Behnken试验对激光参数进行了优化。结果 结果表明,激光表面处理后,介质基板表面的均方根值（Root Mean Square,RMS）由4.7 nm增加到47.51 nm,随着激光输出功率和处理次数的增加,表面峰度（Sku）和表面偏斜（Ssk）度均呈现先增大后减小的趋势,当基材表面分布曲线陡峭且以尖峰为主时（Sku>3, Ssk>0）,基材表面因应力集中导致结合力下降。通过设计计算,得到了以镀层临界载荷为响应值的回归方程：Lc=11.20-0.7750×A-1.83×B+1.51×C-0.3075×AB+0.5125×AC-0.2725×BC-3.67×A2-0.3838×B2-2.31×C2,该模型的R2=0.958 1,优化后的最佳工艺参数为：扫描功率9.997%、扫描次数1、扫描速度437.8 mm/s,该参数下预测的临界载荷为12.99 N。最后,对实验所得的样品进行划格试验,镀层的附着力达到了ISO 0级。结论 所制得的天线实测S11曲线与仿真曲线基本一致。
Abstract
With the development of wireless communication, microstrip antennas have been widely applied in various fields owing to their advantages such as small size, light weight, and low cost. To address the problems commonly existing in traditional antenna manufacturing processes, such as long production cycles, high costs, and easy peeling of coatings, laser surface treatment technology was employed to selectively roughen the FR-4 dielectric substrate, and then the metal layer was prepared through electroless plating. The surface morphology and roughness of the dielectric substrate before and after laser surface treatment were analyzed through Scanning Electron Microscopy (SEM), Scanning Probe Microscopy (SPM), and Laser Microscopy. By examining the microstructure of the dielectric substrate under different laser parameters and the critical load of the coating under different laser parameters, the effects of various laser parameters on the substrate were analyzed. Laser output power (A), treatment times (B), and scanning speed (C) were selected as the independent variables of the experiment, with the critical load (Lc) of the coating as the response value to optimize the laser parameter through a Box-Behnken experimental design. The results showed that after laser surface treatment, the RMS (Root Mean Square) of the substrate increased from 4.7 nm to 47.51 nm. With the increase of laser output power and treatment times, the surface roughness gradually increased, while both surface kurtosis (Sku) and surface skewness (Ssk) showed a trend of first increasing and then decreasing. The critical load also exhibited a trend of first increasing and then decreasing. This indicated that the critical load of the substrate did not increase with the increase of surface roughness. When the surface was predominantly peaked, the critical load of the coating was reduced. By using Design Expert software for design and calculation, a binary multiple regression equation was obtained:Lc=11.20-0.7750×A-1.83×B+1.51×C-0.3075×AB+0.5125×AC-0.2725×BC-3.67×A2-0.3838×B2-2.31×C2. The R² of this model was 0.958 1. By analyzing the F-values, it was found that the order of effect of the three factors (A: 5.61, B: 31.36, C: 21.23) on the critical load of the coating was as follow: treatment times (B) > scanning speed (C) > output power (A). The optimized laser parameters were determined as follow: scanning power 9.997%, scanning times 1, and scanning speed 437.8 mm/s, with a predicted critical load of 12.99 N. A cross-cut test was performed on the experimental samples, and the adhesion of the coating reached ISO class 0. The minimum S11 parameter of the prepared antenna was -32.83 dB, which was less than -10 dB. To sum up, adhesion does not increase with roughness, but rather decreases due to stress concentration. The measured S11 curve of the prepared antenna is basically consistent with the simulated curve, including that the manufacturing process does not significantly affect the input impedance of the antenna, meeting the design requirements. This study has certain innovation and reference value for the preparation of microstrip antennas.
关键词
激光表面处理 /
微带天线 /
化学镀铜 /
响应面试验 /
结合力
Key words
laser surface treatment /
microstrip antenna /
electroless copper plating /
response surface experiment /
bond strength
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