Sn-Bi基焊料界面可靠性关键问题与改性策略研究进展

赏敏; 马海涛; 马浩然; 王加俊; 王云鹏

doi:10.16490/j.cnki.issn.1001-3660.2026.03.017

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表面技术 ›› 2026, Vol. 55 ›› Issue (3) : 219-243. DOI: 10.16490/j.cnki.issn.1001-3660.2026.03.017

表界面强化技术

Sn-Bi基焊料界面可靠性关键问题与改性策略研究进展

赏敏^a, 马海涛^a,*, 马浩然^b, 王加俊^a, 王云鹏^a

作者信息 +

Research Progress in Key Interfacial Reliability Issues and Modification Strategies for Sn-Bi Based Solders

SHANG Min^a, MA Haitao^a,*, MA Haoran^b, WANG Jiajun^a, WANG Yunpeng^a

Author information +

文章历史 +

摘要

系统综述了旨在提升Sn-Bi焊点界面可靠性的多层次改性策略。首先,评述了通过焊料合金化调控其本征性能的方法,系统分析了添加Ag、Cu、Ni、In、Sb、Zn、Co等元素对焊料微观结构、力学性能及界面反应动力学的影响。其次,探讨了以石墨烯为代表的纳米颗粒强化机制,阐明其在细化晶粒和抑制IMC生长方面的作用。随后,重点阐述了以基板改性为核心的界面工程策略,深入剖析了Ni基金属镀层和Ni-P、Ni-W-P等先进复合镀层作为扩散阻挡层的核心机理,即通过改变界面反应热力学路径来抑制原子互扩散。同时,也关注了复合改性方法,如焊料合金化与基板表面处理,如ENEPIG的协同作用。最后,对未来研究方向进行了展望,指出开发高熵/非晶合金等新型阻挡层,并结合计算材料学与先进原位表征技术,将是实现下一代高可靠性Sn-Bi焊点界面“按需设计”的关键。

Abstract

The intrinsic brittleness and interfacial instability of Sn-Bi based solder joints, particularly under thermo- mechanical and electrical stresses, present a critical bottleneck for their broader application in next-generation electronics. While the correlation between interfacial phenomena, such as runaway intermetallic compound (IMC) growth, Bi phase segregation, and Kirkendall voiding, and joint failures is well-established, a systematic, multi-scale framework for mitigating these degradation pathways remains elusive. This review moves beyond a mere compilation of existing data to provide a critical synthesis and forward-looking analysis of modification strategies, uniquely structuring them into a hierarchical framework encompassing (1) bulk solder alloy design, (2) advanced substrate/interface engineering, and (3) synergistic system-level integration. The central thesis posits that achieving transformative reliability gains necessitates a holistic approach that simultaneously optimizes the thermodynamic and kinetic stability of the entire solder/interface/substrate system.
The analysis begins with a deep dive into the mechanistic role of micro-alloying additions, categorizing them not merely by element but by their primary function in mitigating specific failure modes. For instance, while Ag additions (optimally 0.3wt.%-0.4wt.%) are shown to refine microstructure via dispersed Ag₃Sn precipitates, the existing controversy regarding their limited efficacy in suppressing Cu-Sn IMC growth is critically highlighted compared with other elements. Conversely, the review elucidates how In additions (<1.5wt.%) fundamentally alter the interfacial thermodynamics by promoting the formation of Cu₆(Sn,In)₅, which directly combats the primary failure mechanism of brittle Bi phase segregation at the solder/IMC interface. The review further dissects the dual-edged nature of elements like Zn, which, despite inhibiting the formation of brittle Cu₃Sn, can trigger catastrophic failure through the rapid growth of Cu₅Zn₈ at concentrations exceeding ~1.0 wt.%. The critical role of Co in enhancing electromigration resistance by forming stable (Cu, Co)₆Sn₅ phases, thereby suppressing current-induced Bi migration, is also systematically detailed.
The core innovation of this review lies in its comprehensive treatment of interface engineering through the lens of diffusion barrier technology. It quantitatively frames the fundamental strategy as a deliberate shift in the interfacial reaction pathway from the kinetically facile but unstable Cu-Sn reaction (forming Cu₆Sn₅, ΔG≈-7.4 kJ·mol^-1·atom^-1) to the thermodynamically robust Ni-Sn reaction (forming Ni₃Sn₄, ΔG≈-30 kJ·mol^-1·atom^-1). The efficacy of electroless Ni-P layers is deconstructed into a dual-mechanism model: the amorphous structure eliminates grain boundary diffusion paths, while the in-situ formation of a P-rich Ni₃P layer at the advancing reaction front acts as a secondary, self-healing barrier. Then, it advances the discussion to state-of-the-art composite barriers, such as Ni-W-P, detailing how the incorporation of refractory elements like W introduces a potent solute-drag effect and elevates the layer's crystallization temperature, thereby extending its operational lifetime under harsh thermal conditions. The review also introduces atomically thin 2D materials, exemplified by graphene, as a paradigm- shifting ultimate physical barrier, capable of almost completely arresting atomic interdiffusion.
Finally, it synthesizes these individual strategies into a system-level perspective, demonstrating how synergistic interplay yields performance unattainable by any single modification. A key example analyzed is the combination of Pt nanoparticle- doped Sn-Bi solder with an ENEPIG (Electroless Nickel-Electroless Palladium-Immersion Gold) substrate finish. Here, it reveals the formation of a uniquely stable (Pd,Pt,Ni)Sn₄ interfacial phase, which acts as a far superior diffusion barrier than the conventional Ni₃Sn₄, drastically reducing Ni-P layer consumption and ensuring long-term microstructural integrity.
Looking forward, this review charts a strategic roadmap for future research, advocating for a paradigm shift from empirical trial-and-error to “design-on-demand” interfacial systems. It identifies the development of high-entropy alloy (HEA) and metallic glass (MG) coatings as a critical frontier for creating next-generation, near-perfect diffusion barriers. Furthermore, it proposes the integration of advanced computational tools (e.g., CALPHAD, first-principles calculations) with sophisticated in-situ characterization techniques (e.g., synchrotron radiation, transmission electron microscopy under electrical/thermal loading) to close the loop between predictive modeling and experimental validation of interfacial degradation dynamics. This integrated approach is presented as the essential pathway to engineering ultra-reliable Sn-Bi interconnects for future mission-critical electronic applications.

导出引用

赏敏, 马海涛, 马浩然, 王加俊, 王云鹏. Sn-Bi基焊料界面可靠性关键问题与改性策略研究进展[J]. 表面技术. 2026, 55(3): 219-243

SHANG Min, MA Haitao, MA Haoran, WANG Jiajun, WANG Yunpeng. Research Progress in Key Interfacial Reliability Issues and Modification Strategies for Sn-Bi Based Solders[J]. Surface Technology. 2026, 55(3): 219-243

中图分类号： TG425+.1

参考文献

[1] DELE-AFOLABI T T, ANSARI M N M, AZMAH HANIM M A, et al. Recent Advances in Sn-Based Lead-Free Solder Interconnects for Microelectronics Packaging: Materials and Technologies[J]. Journal of Materials Research and Technology, 2023, 25: 4231-4263.
[2] JIANG N, ZHANG L, LIU Z Q, et al.Reliability Issues of Lead-Free Solder Joints in Electronic Devices[J]. Science and Technology of Advanced Materials, 2019, 20(1): 876-901.
[3] BOESENBERG A J, ANDERSON I E, HARRINGA J L.Development of Sn-Ag-Cu-X Solders for Electronic Assemblyby Micro-Alloying with Al[J]. Journal of Electronic Materials, 2012, 41(7): 1868-1881.
[4] TURBINI L J, MUNIE G C, BERNIER D, et al.Examining the Environmental Impact of Lead-Free Soldering Alternatives[J]. IEEE Transactions on Electronics Packaging Manufacturing, 2001, 24(1): 4-9.
[5] JOSCHA B, ANNKATRIN K, MICHAEL R.Beyond RoHS and REACH: Relevant CMR Substances in Electronic Products[C]//Proceedings of 2024 Electronics Goes Green 2024+(EGG). Berlin: IEEE, 2024.
[6] KANG H, RAJENDRAN S H, JUNG J P.Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics[J]. Metals, 2021, 11(2): 364.
[7] WANG F J, LUKTUKE A, CHAWLA N.Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint during Aging[J]. Journal of Electronic Materials, 2021, 50(12): 6607-6614.
[8] MEI Z, HOLDER H A, VANDER PLAS H A. Low-Temperature Solders[J]. Hewlett Packard Journal, 1996, 47: 91-98.
[9] LIU Y, TU K N.Low Melting Point Solders Based on Sn, Bi, and in Elements[J]. Materials Today Advances, 2020, 8: 100115.
[10] WADUGE G D, BATY G, LEE Y W, et al.Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability[J]. Journal of Electronic Materials, 2022, 51(3): 1169-1179.
[11] LIU L, XUE S B, NI R Y, et al.Board Level Drop Test for Evaluating the Reliability of High-Strength Sn-Bi Composite Solder Pastes with Thermosetting Epoxy[J]. Crystals, 2022, 12(7): 924.
[12] 李琴, 雷永平, 符寒光, 等. Sn-Bi-In低温无铅钎料的组织和性能[J]. 稀有金属材料与工程, 2017, 46(10): 3038-3042.
LI Q, LEI Y P, FU H G, et al.Microstructures and Properties of Sn-Bi-in Low-Temperature Lead-Free Solders[J]. Rare Metal Materials and Engineering, 2017, 46(10): 3038-3042.
[13] MIAO H W, DUH J G.Microstructure Evolution in Sn-Bi and Sn-Bi-Cu Solder Joints under Thermal Aging[J]. Materials Chemistry and Physics, 2001, 71(3): 255-271.
[14] SHANG M, YAO J Y, XING J, et al.Ni and Ni-P Substrates Inhibit Bi Phase Segregation and IMC Overgrowth during the Soldering Process of Sn-Bi Solder[J]. Materials Chemistry and Physics, 2024, 325: 129726.
[15] CHEN H F, LIU Y, ZHANG S, et al.Effects of Sn-Ag-x Leveling Layers on the Microstructure and Shear Behavior of Sn-58Bi Solder Joint under Thermal Cycling[J]. Journal of Materials Science: Materials in Electronics, 2023, 34(3): 223.
[16] QIN W O, YANG W C, ZHANG L, et al.Effect of Ni-Modified Reduced Graphene Oxide on the Mechanical Properties of Sn-58Bi Solder Joints[J]. Vacuum, 2023, 211: 111943.
[17] WANG Q, CAI S S, YANG S Y, et al.Comparison of High-Speed Shear Properties of Low-Temperature Sn-Bi/Cu and Sn-in/Cu Solder Joints[J]. Journal of Materials Science: Materials in Electronics, 2024, 35(8): 576.
[18] YANG M K, ZHAO X C, HUO Y J, et al.Comparison between Bulk and Particle Solder Alloy on the Performance of Low-Melting Solder Joints[J]. Journal of Materials Research and Technology, 2023, 24: 71-80.
[19] YANG F, ZHANG L, LIU Z Q, et al.Properties and Microstructures of Sn-Bi-X Lead-Free Solders[J]. Advances in Materials Science and Engineering, 2016(1): 15.
[20] CHEN C, ZHANG L, CHEN M, et al.Application of Ultrasonic Power in Forming Sn₅₈Bi/Cu Solder Joints with Trace Si₃N₄ Nanowire Doping[J]. Journal of Materials Engineering and Performance, 2025, 34(6): 5263-5272.
[21] WANG F J, CHEN H, HUANG Y, et al.Recent Progress on the Development of Sn-Bi Based Low-Temperature Pb-Free Solders[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(4): 3222-3243.
[22] ZHANG Q K, ZOU H F, ZHANG Z F.Improving Tensile and Fatigue Properties of Sn-58Bi/Cu Solder Joints through Alloying Substrate[J]. Journal of Materials Research, 2010, 25(2): 303-314.
[23] LIU P L, SHANG J K.Segregant-Induced Cavitation of Sn/Cu Reactive Interface[J]. Scripta Materialia, 2005, 53(6): 631-634.
[24] SHANG P J, LIU Z Q, ZHANG L, et al.TEM Study of Bi Segregation in the Interconnect of Eutectic Tin-Bismuth Solder and Copper[C]//Proceedings of 2007 8th International Conference on Electronic Packaging Technology. Shanghai: IEEE, 2008.
[25] SHANG P J, LIU Z Q, LI D X, et al.Bi-Induced Voids at the Cu₃Sn/Cu Interface in Eutectic SnBi/Cu Solder Joints[J]. Scripta Materialia, 2008, 58(5): 409-412.
[26] SINGH P, PALMER L, WASSICK T, et al.Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints[C]//Proceedings of 2024 IEEE 74th Electronic Components and Technology Conference (ECTC). Denver: IEEE, 2024.
[27] SINGH P, PALMER L, HAMID M, et al.A Novel Setup for Studying Electromigration[C]//SMTA Pan Pacific Microelectronics Symposium. Hawaii:[s.n.] , 2022.
[28] KAMARUZZAMAN L S, GOH Y.Effects of Alloying Element on Mechanical Properties of Sn-Bi Solder Alloys: A Review[J]. Soldering & Surface Mount Technology, 2022, 34(5): 300-318.
[29] LI W Y, MO L Q, LI X M, et al.Minor Ag Induced Shear Performance Alternation in BGA Structure Cu/SnBi/Cu Solder Joints under Electric Current Stressing[J]. Journal of Materials Research and Technology, 2023, 25: 6111-6122.
[30] CHENG D H, SHAO J H, CHENG Y P, et al.Study on the Interfacial Organization of Sn-58Bi-Ag Low-Temperature Composite Brazing Material/Cu[C]//Proceedings of Abstracts of the 16th National Welding Conference.[s.l.] : Chinese Mechanical Engineering Society, 2011.
[31] SUN H Y, LI Q Q, CHAN Y C.A Study of Ag Additive Methods by Comparing Mechanical Properties between Sn_57.6Bi_0.4Ag and 0.4wt% Nano-Ag-Doped Sn₅₈Bi BGA Solder Joints[J]. Journal of Materials Science: Materials in Electronics, 2014, 25(10): 4380-4390.
[32] ZHANG Y M.Effect of Ag on Indentation Creep Property and Microstructure of Sn-Bi Solder[J]. Journal of Xihua University, 2010.
[33] KAUSHIK R K, BATRA U, SHARMA J D.Structural, Thermal and Wetting Characteristics of Novel Low Bi-Low Ag Containing Sn-xag-0.7Cu-1.0Bi (x =0.5 to 1.5) Alloys for Electronic Application[J]. Metals and Materials International, 2021, 27(11): 4550-4563.
[34] JEONG G, YU D Y, BAEK S, et al.Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding[J]. Materials, 2021, 14(2): 335.
[35] GUANG R, MAURICE N C.Improved Reliability And Mechanical Performance of Sn58Bi Solder Alloys[J]. Metals, 2019, 9: 642.
[36] HU T H, LI S, LI Z, et al.Coupled Effect of Ag and in Addition on the Microstructure and Mechanical Properties of Sn-Bi Lead-Free Solder Alloy[J]. Journal of Materials Research and Technology, 2023, 26: 5902-5909.
[37] SILVA B L, GARCIA A, SPINELLI J E.Cooling Thermal Parameters and Microstructure Features of Directionally Solidified Ternary Sn-Bi-(Cu, Ag) Solder Alloys[J]. Materials Characterization, 2016, 114: 30-42.
[38] SILVA B L, XAVIER M G C, GARCIA A, et al. Cu and Ag Additions Affecting the Solidification Microstructure and Tensile Properties of Sn-Bi Lead-Free Solder Alloys[J]. Materials Science and Engineering: A, 2017, 705: 325-334.
[39] ZHANG L, SUN L, GUO Y H.Microstructures and Properties of Sn₅₈Bi, Sn₃₅Bi_0.3Ag, Sn₃₅Bi_1.0Ag Solder and Solder Joints[J]. Journal of Materials Science: Materials in Electronics, 2015, 26(10): 7629-7634.
[40] 姚宗湘, 罗键, 尹立孟, 等. Bi含量对Cu/Sn-0.3Ag-0.7Cu/Cu微焊点蠕变性能的影响[J]. 中国有色金属学报, 2017, 27(12): 2545-2551.
YAO Z X, LUO J, YIN L M, et al.Effect of Bi Content on Creep Properties of Cu/Sn-0.3Ag-0.7Cu/Cu Solder Joints[J]. The Chinese Journal of Nonferrous Metals, 2017, 27(12): 2545-2551.
[41] FOWLER H N, PUTTUR LAKSHMINARAYANA S A, LAI S Y, et al. Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys[J]. Journal of Electronic Materials, 2024, 53(3): 1284-1298.
[42] LI S, WANG X, LIU Z, et al.Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys[J]. Journal of Nanomaterials, 2020, 2020: 1-25.
[43] SHEN J, PU Y Y, YIN H G, et al.Effects of Minor Cu and Zn Additions on the Thermal, Microstructure and Tensile Properties of Sn-Bi-Based Solder Alloys[J]. Journal of Alloys and Compounds, 2014, 614: 63-70.
[44] TAKAO H, YAMADA A, HASEGAWA H, et al.Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy[J]. Journal of Japan Institute of Electronics Packaging, 2002, 5(2): 152-158.
[45] LAI Z M, YE D.Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint[J]. Journal of Electronic Materials, 2016, 45(7): 3702-3711.
[46] YAO Z X, LING D Y, LIU Y K, et al.Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys[J]. Journal of Electronic Materials, 2022, 51(7): 3552-3559.
[47] 尹恒刚, 史素娟, 许浩, 等. Sn-Bi/Cu焊接接头的剪切性能及界面微观组织分析[J]. 上海有色金属, 2015, 36(2): 56-60.
YIN H G, SHI S J, XU H, et al.Analysis of Shear Property and Interfacial Intermetallic Compounds of Sn-Bi/Cu Solder Joints[J]. Shanghai Nonferrous Metals, 2015, 36(2): 56-60.
[48] YANG L Z, ZHOU W, MA Y, et al.Effects of Ni Addition on Mechanical Properties of Sn₅₈Bi Solder Alloy during Solid-State Aging[J]. Materials Science and Engineering: A, 2016, 667: 368-375.
[49] SHEN B W, YANG S R, XU M Y, et al.Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg-XIn/Cu Solder Joints[J]. Metals, 2022, 12(10): 16.
[50] MOKHTARI O, NISHIKAWA H.Effects of Minor Alloying Additive on the Shear Strength of Sn-58Bi Solder Joint[J]. International Symposium on Microelectronics, 2013, 2013(1): 100-103.
[51] DA SILVA LEAL J R, REYES R A V, DE GOUVEIA G L, et al. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-in Solder Alloys in Copper and Nickel Interfaces[J]. Metals, 2024, 14(9): 963.
[52] WANG Z, ZHANG Q K, CHEN Y X, et al.Influences of Ag and in Alloying on Sn-Bi Eutectic Solder and SnBi/Cu Solder Joints[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(20): 18524-18538.
[53] FOWLER H N, LOAIZA A, BAHR D F, et al.Sb Additions in Near-Eutectic Sn-Bi Solder Decrease Planar Slip[J]. Journal of Electronic Materials, 2023, 52(11): 7365-7370.
[54] ZHANG J H, ZHAO Y H, WANG X J, et al.Microstructures and Shear Properties of Antimony-and Indium-Strengthened Sn₅Bi/Cu Joints[J]. Advanced Composites and Hybrid Materials, 2024, 7(3): 78.
[55] WANG F J, LV P C, ZHANG J Y.Effect of Minor Sb Addition on Microstructure, Interfacial Behavior, and Mechanical Properties of Sn-15Bi Solder Joints[J]. Journal of Materials Science: Materials in Electronics, 2024, 35(18): 1274.
[56] HOU Z Z, ZHAO X C, WANG Y, et al.Alloying Regulation Mechanism Toward Microstructure Evolution of Sn-Bi-Based Solder Joint under Current Stress[J]. Materials Characterization, 2022, 191: 112094.
[57] FOWLER H N, TAY S X, BLENDELL J, et al.Microalloying Effects of Sb and Ag on the Microstructural Evolution of Eutectic Sn-Bi Alloys[J]. MRS Advances, 2023, 8(14): 763-767.
[58] 赵瑾, 籍晓亮, 贾强, 等. 微电子封装低温Sn-xBi-yM合金钎料研究现状与展望[J]. 稀有金属材料与工程, 2024, 53(4): 1181-1194.
ZHAO J, JI X L, JIA Q, et al.Research Advances and Prospect of Low-Temperature Sn-xBi-yM Alloy Solders for Microelectronic Packaging[J]. Rare Metal Materials and Engineering, 2024, 53(4): 1181-1194.
[59] 王凤江, 何其航. 添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响[J]. 机械工程学报, 2022, 58(2): 284-290.
WANG F J, HE Q H.Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging[J]. Journal of Mechanical Engineering, 2022, 58(2): 284-290.
[60] YAN L J, HUANG Y Q, JI H T, et al.Research Progress of Improving Mechanical Properties of Sn-Bi Series Lead-Free Solder[J]. ZGGX, 2022, 50(2): 41-44.
[61] ZHOU S Q, MOKHTARI O, RAFIQUE M G, et al.Improvement in the Mechanical Properties of Eutectic Sn₅₈Bi Alloy by 0.5 and 1 wt% Zn Addition before and after Thermal Aging[J]. Journal of Alloys and Compounds, 2018, 765: 1243-1252.
[62] WANG Q F, CHEN H, WANG F J.Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition[J]. Materials, 2019, 12(24): 4240.
[63] WANG X J, WANG Y L, WANG F J, et al.Effects of Zn, Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder[J]. Acta Metallurgica Sinica (English Letters), 2014, 27(6): 1159-1164.
[64] 董昌慧, 王凤江, 丁海健, 等. 微量Co的添加对Sn-Bi共晶钎料性能的影响[J]. 热加工工艺, 2015, 44(1): 190-192.
DONG C H, WANG F J, DING H J, et al.Effect of Addition of Co Element on Properties of Sn-Bi Eutectic Solder[J]. Hot Working Technology, 2015, 44(1): 190-192.
[65] LI Z B, LI H T, GUO Y L, et al.Effect of Co Particle Content on Microstructure and Properties of SnBi/Cu Joints[J]. Journal of Materials Engineering, 2022, 7(50): 149-155.
[66] HUANG X, ZHANG L, DENG K, et al.Investigating the Impact of Cobalt Incorporation on the Transformation of Cu₆Sn5 Layer to (Cu, Co)₆Sn5: Microstructural and Mechanical Insights[J]. Materials Characterization, 2024, 212: 113934.
[67] KAMARUZZAMAN L S, GOH Y.Microstructure and Tensile Properties of Sn-Bi-Co Solder Alloy[J]. Journal of Materials Science: Materials in Electronics, 2023, 34(4): 312.
[68] HUANG Y C, CHEN S W.Effects of Co Alloying and Size on Solidificationand Interfacial Reactions in Sn-57wt.%Bi-(Co)/Cu Couples[J]. Journal of Electronic Materials, 2011, 40(1): 62-70.
[69] ZHU W B, ZHANG W W, ZHOU W, et al.Improved Microstructure and Mechanical Properties for SnBi Solder Alloy by Addition of Cr Powders[J]. Journal of Alloys and Compounds, 2019, 789: 805-813.
[70] PENG Y T, DENG K.Study on the Mechanical Properties of the Novel Sn-Bi/Graphene Nanocomposite by Finite Element Simulation[J]. Journal of Alloys and Compounds, 2015, 625: 44-51.
[71] MA Y, LI X Z, ZHOU W, et al.Reinforcement of Graphene Nanosheets on the Microstructure and Properties of Sn₅₈Bi Lead-Free Solder[J]. Materials & Design, 2017, 113: 264-272.
[72] MA Y, LI X Z, YANG L Z, et al.Effects of Graphene Nanosheets Addition on Microstructure and Mechanical Properties of SnBi Solder Alloys during Solid-State Aging[J]. Materials Science and Engineering: A, 2017, 696: 437-444.
[73] MAO Z, ZHANG W W, LI J S, et al.The Obstruction Effect of Ni Layer on the Interdiffusion of Cu Substrate and Sn Solder: A Theoretical Investigation[J]. Journal of Electronic Materials, 2020, 49(11): 6559-6571.
[74] VASSILEV G, MILCHEVA N, RECORD M C, et al.Diffusion Couple Studies of the Ni-Bi-Sn System[J]. Journal of Mining and Metallurgy, Section B: Metallurgy, 2012, 48(3): 347-357.
[75] FOUZDER T, CHAN Y C, CHAN D K.Influence of Cerium Oxide (CeO₂) Nanoparticles on the Microstructure and Hardness of Tin-Silver-Copper (Sn-Ag-Cu) Solders on Silver (Ag) Surface-Finished Copper (Cu) Substrates[J]. Journal of Materials Science: Materials in Electronics, 2014, 25(12): 5375-5387.
[76] JIANG S W, KUANG Z X, HU X M, et al.Study on the Preparation and Properties of a Co-Based Barrier Layer by Diffusion Welding[J]. Journal of Electronic Materials, 2024, 53(4): 1720-1730.
[77] LI J F, MANNAN S H, CLODE M P, et al.Interfacial Reaction between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects[J]. IEEE Transactions on Components and Packaging Technologies, 2008, 31(3): 574-585.
[78] WANG F J, HUANG Y, ZHANG Z J, et al.Interfacial Reaction and Mechanical Properties of Sn-Bi Solder Joints[J]. Materials, 2017, 10(8): 920.
[79] 卢汉桥, 李玉龙, 余啸, 等. 回流冷却与等温时效过程中Sn-35Bi-1Ag/Ni-P/Cu焊点组织演变[J]. 材料工程, 2018, 46(6): 95-100.
LU H Q, LI Y L, YU X, et al.Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints during Post-Reflow Cooling and Isothermal Aging[J]. Journal of Materials Engineering, 2018, 46(6): 95-100.
[80] CHEN K, LIU C, WHALLEY D C, et al.Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects[C]//Proceedings of 2006 1st Electronic System Integration Technology Conference. Dresden: IEEE, 2007.
[81] LI C Y, SU X L, ZHANG Z X, et al.The Interfacial Reaction between Amorphous Ni-W-P Coating and Sn-58Bi Solder[J]. Metals, 2024, 14(10): 1107.
[82] PAN H C, HSIEH T E.An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W, P) Layer to Lead-Free SnBi Solder[J]. Journal of Electronic Materials, 2011, 40(3): 330-339.
[83] WANG F J, LI D Y, ZHANG Z J, et al.Improvement on Interfacial Structure and Properties of Sn-58Bi/Cu Joint Using Sn-3.0Ag-0.5Cu Solder as Barrier[J]. Journal of Materials Science: Materials in Electronics, 2017, 28(24): 19051-19060.
[84] LIU Y, LI S L, SONG W, et al.Interfacial Reaction, Microstructure and Mechanical Properties of Sn₅₈Bi Solder Joints on Graphene-Coated Cu Substrate[J]. Results in Physics, 2019, 13: 102256.
[85] ZHANG S, JING X Y, CHEN J S, et al.Preparation, Characterization and Mechanical Properties Analysis of SAC305-SnBi-Co Hybrid Solder Joints for Package-on-Package Technology[J]. Materials Characterization, 2024, 208: 113624.
[86] CHEN C, ZHANG L, WANG X, et al.Microstructure and Properties of Sn₅₈Bi/Ni Solder Joint Modified by Mg Particles[J]. Journal of Materials Research and Technology, 2023, 24: 514-526.
[87] RAJENDRAN S H, KU J H, KANG J W, et al.Al₂O₃ Nanofibers Reinforced Sn₅₈Bi/SAC 305 Hybrid Joints for Low Temperature Ball Grid Array Bonding[J]. Materials Today Communications, 2024, 38: 108250.
[88] CHOI H, KIM C L, SOHN Y.Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes[J]. Materials, 2022, 15(23): 8419.