氮化硅陶瓷磨削亚表面损伤深度仿真与试验研究

孙健, 王禄, 王超, 张阳, 张志利, 姚金梅

表面技术 ›› 2026, Vol. 55 ›› Issue (3) : 160-170.

PDF(2491 KB)
PDF(2491 KB)
表面技术 ›› 2026, Vol. 55 ›› Issue (3) : 160-170. DOI: 10.16490/j.cnki.issn.1001-3660.2026.03.013
精密与超精密加工

氮化硅陶瓷磨削亚表面损伤深度仿真与试验研究

  • 孙健1, 王禄1, 王超2, 张阳1, 张志利3, 姚金梅1,*
作者信息 +

Simulation and Experimental Study on the Depth of Ground Sub-surface Damage of Silicon Nitride Ceramics

  • SUN Jian1, WANG Lu1, WANG Chao2, ZHANG Yang1, ZHANG Zhili3, YAO Jinmei1,*
Author information +
文章历史 +

摘要

目的 揭示磨削参数对氮化硅亚表面损伤深度的影响规律,为磨削加工中降低损伤深度、提高生产效率提供指导。方法 建立氮化硅陶瓷磨削力和裂纹扩展仿真模型,并提出一种基于这2个仿真模型的氮化硅陶瓷磨削亚表面损伤深度预测方法。通过超精密平面磨床,对氮化硅陶瓷片进行磨削试验研究,系统探索砂轮线速度(vs)、磨削深度(ap)、工件进给速度(vw)对磨削后亚表面损伤深度的影响规律。通过扫描电镜(SEM)观测磨削后氮化硅陶瓷亚表面损伤的特征。通过对试验数据进行分析,优化氮化硅磨削亚表面损伤深度的数学预测模型。结果 经试验验证,2个仿真模型均具有较高的精度,基于这2个仿真模型的氮化硅陶瓷磨削亚表面损伤深度预测方法的最大误差在9%以内。试验结果表明,损伤深度随着工件进给速度和磨削深度的增加而增加,随着砂轮线速度的增加而减小,且磨削深度和砂轮线速度对损伤的影响较大。优化后的氮化硅磨削亚表面损伤深度数学模型预测值与实测值的平均偏差率为8.9%,将最大绝对误差控制在11%以内。结论 研究结果为氮化硅陶瓷的高效、低损伤磨削提供了理论依据,并为相关工艺的优化提供了理论支持。

Abstract

The work aims to reveal the effect of grinding parameters on the sub-surface damage depth of silicon nitride, to guide the processing to reduce the damage depth and improve productivity. Firstly, simulation models were constructed for grinding force and crack propagation of silicon nitride ceramics. Based on the mechanical mechanism in the material removal process, combined with the performance parameters of silicon nitride ceramics, the finite element analysis method was used to simulate the stress distribution, material deformation, and crack initiation and propagation during the grinding process. On this basis, an innovative prediction method for the ground sub-surface damage depth of silicon nitride ceramics based on these two simulation models was proposed. This method combined the grinding force with the crack propagation process, fully considering various complex factors in the processing, and providing a theoretical basis for subsequent research. To verify the accuracy of the simulation models and the prediction method, the research team carried out grinding experiments on silicon nitride ceramic sheets with the help of an ultra-precision surface grinder. In the experiments, the effect laws of grinding wheel linear speed (vs), grinding depth (ap), and workpiece feed speed (vw) on the sub-surface damage depth after grinding were systematically explored. A scanning electron microscope (SEM) was used to carefully observe the sub-surface damage characteristics of the ground silicon nitride ceramics, capturing key information such as crack morphology, distribution, and propagation path. At the same time, in-depth analysis was conducted on the experiment data, and the mathematical prediction model for the ground sub-surface damage depth of silicon nitride was continuously optimized to make it more in line with the actual processing situation. The experiment results showed that the two constructed simulation models exhibited high accuracy. The maximum error of the prediction method for the ground sub-surface damage depth of silicon nitride ceramics based on these two models was controlled within 9%, which fully verified the effectiveness of the method. Further analysis of the experimental results found that the damage depth was significantly related to various grinding parameters: with the increase of workpiece feed speed and grinding depth, the grinding force increased, leading to a corresponding increase in damage depth, while the increase of grinding wheel linear speed could shorten the contact time between abrasive grains and materials, reduce the single cutting force, and thus reduce the damage depth. In addition, the grinding depth and grinding wheel linear speed had a more significant impact on the damage, which required more attention in actual processing. The optimized mathematical model for the ground sub-surface damage depth of silicon nitride had an average deviation rate of 8.9% between the predicted values and the measured values, and the maximum absolute error was controlled within 11%, which greatly improved the accuracy of the prediction. The results of this study provide a solid theoretical basis for efficient and low damage grinding of silicon nitride ceramics. At the same time, it also offers strong theoretical support for the optimization of related processes and is of great significance for promoting the wide application of silicon nitride ceramics in the field of high-end equipment manufacturing.

关键词

氮化硅陶瓷 / 磨削力 / 亚表面损伤 / 有限元仿真 / 离散元仿真

Key words

silicon nitride ceramics / grinding force / sub-surface damage / finite element simulation / discrete element simulation

引用本文

导出引用
孙健, 王禄, 王超, 张阳, 张志利, 姚金梅. 氮化硅陶瓷磨削亚表面损伤深度仿真与试验研究[J]. 表面技术. 2026, 55(3): 160-170
SUN Jian, WANG Lu, WANG Chao, ZHANG Yang, ZHANG Zhili, YAO Jinmei. Simulation and Experimental Study on the Depth of Ground Sub-surface Damage of Silicon Nitride Ceramics[J]. Surface Technology. 2026, 55(3): 160-170
中图分类号: TG582   

参考文献

[1] SHAMRAY S, AZARHOUSHANG B, PAKNEJAD M, et al.Ductile-Brittle Transition Mechanisms in Micro-Grinding of Silicon Nitride[J]. Ceramics International, 2022, 48(23): 34987-34998.
[2] RAZA M N, LIN S Y.Experimental Investigation of Milling Performance of Silicon Nitride Ceramic Subject to Different Assisted Systems[J]. Materials, 2023, 16(1): 137.
[3] ZHAO B Y, DAI H D, WANG Y H, et al.Optimization of Grinding Process for Hard and Brittle Materials Based on Damage Evolution Mechanism[J]. Precision Engineering, 2024, 86: 376-387.
[4] WANG X L, LI S H, FAN S Q, et al.Study on Properties and Tribological Behaviors of Silicon Nitride-Based Ti-DLC Films[J]. Surface and Coatings Technology, 2025, 506: 132131.
[5] ARMIN F, COIA C, NABKI F, et al.Compact Silicon Nitride Interferometers[J]. Optics Express, 2023, 31(10): 16920-16928.
[6] SUN C, ZHANG H, HONG Y, et al.Surface Modification Mechanism of Silicon Nitride by LAG[J]. The International Journal of Advanced Manufacturing Technology, 2024, 135(7): 3147-3158.
[7] GHADIRI ZAHRANI E, PAKNEJAD M, ZAHEDI A, et al.Investigation of Laser-Assisted Cylindrical Grinding of Silicon Nitride Ceramics with Controlled Damage Zone[J]. Optics & Laser Technology, 2024, 174: 110616.
[8] WANG J X, WU C J, ZHENG D H, et al.Laser Prefabricated Circular Groove-Assisted Grinding of Si3N4 Ceramics: Surface Quality Analysis and Process Optimization[J]. Journal of Manufacturing Processes, 2025, 136: 148-161.
[9] FU H, JIANG L P, SONG Q H, et al.Grinding Surface Roughness Prediction for Silicon Nitride Ceramics: A Dynamic Grinding Force and Frequency Domain Approach[J]. Ceramics International, 2023, 49(22): 35239-35253.
[10] LIU W, DENG Z H, SHANG Y Y, et al.Effects of Grinding Parameters on Surface Quality in Silicon Nitride Grinding[J]. Ceramics International, 2017, 43(1): 1571-1577.
[11] OHJI T, TATAMI J.Processing-Structure-Microscale Properties of Silicon Nitride[J]. Ceramics International, 2024, 50(19): 37282-37290.
[12] LIU W, TANG D B, LIU R T, et al.Ductile Regime Grinding of Silicon Nitride Ceramics Based on Dynamic Critical Grinding Depth[J]. The International Journal of Advanced Manufacturing Technology, 2022, 121(9): 6431-6438.
[13] PAKNEJAD M, AZARHOUSHANG B, ZAHEDI A, et al.Investigation of Material Removal Mechanisms of Laser-Structured Si3N4 via Single Diamond Grit Scratching[J]. The International Journal of Advanced Manufacturing Technology, 2023, 125(5): 2759-2775.
[14] YAN H P, DENG F, QIN Z Y, et al.Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics[J]. Micromachines, 2023, 14(3): 666.
[15] YAN H P, DENG F, NIU H L, et al.Effect of Grinding Parameters on Surface Quality in Internal Grinding of Silicon Nitride Ceramics[J]. Journal of the Brazilian Society of Mechanical Sciences and Engineering, 2021, 43(7): 353.
[16] ZHANG X H, WEN D D, SHI Z Y, et al.Grinding Performance Improvement of Laser Micro-Structured Silicon Nitride Ceramics by Laser Macro-Structured Diamond Wheels[J]. Ceramics International, 2020, 46(1): 795-802.
[17] AGARWAL S, RAO P V.Experimental Investigation of Surface/Subsurface Damage Formation and Material Removal Mechanisms in SiC Grinding[J]. International Journal of Machine Tools and Manufacture, 2008, 48(6): 698-710.
[18] DAI J B, SU H H, YU T F, et al.Experimental Investigation on Materials Removal Mechanism during Grinding Silicon Carbide Ceramics with Single Diamond Grain[J]. Precision Engineering, 2018, 51: 271-279.
[19] HUANG H, YIN L, ZHOU L B.High Speed Grinding of Silicon Nitride with Resin Bond Diamond Wheels[J]. Journal of Materials Processing Technology, 2003, 141(3): 329-336.
[20] CHEN M J, ZHAO Q L, DONG S, et al.The Critical Conditions of Brittle-Ductile Transition and the Factors Influencing the Surface Quality of Brittle Materials in Ultra-Precision Grinding[J]. Journal of Materials Processing Technology, 2005, 168(1): 75-82.
[21] LI W, WANG Y, FAN S H, et al.Wear of Diamond Grinding Wheels and Material Removal Rate of Silicon Nitrides under Different Machining Conditions[J]. Materials Letters, 2007, 61(1): 54-58.
[22] NAITO M, HOTTA T, HAYAKAWA O, et al.Ball Milling Conditions of a very Small Amount of Large Particles in Silicon Nitride Powder[J]. Journal of the Ceramic Society of Japan, 1998, 106(1236): 811-814.
[23] MOCHIDA Y, NISHIOKA T, YAMAKAWA A, et al.Ultra-High-Speed Grinding of Si3N4 Ceramics[J]. Journal of the Ceramic Society of Japan, 1997, 105(1225): 784-788.
[24] AGARWAL S, VENKATESWARA RAO P.Modeling and Prediction of Surface Roughness in Ceramic Grinding[J]. International Journal of Machine Tools and Manufacture, 2010, 50(12): 1065-1076.
[25] WAN L L, LIU Z J, DENG Z H, et al.Simulation and Experimental Research on Subsurface Damage of Silicon Nitride Grinding[J]. Ceramics International, 2018, 44(7): 8290-8296.

基金

国家重点研发计划(2024YFB3410201); 辽宁省教育厅重点项目(LJ212510153032); 辽宁省科技厅博士启动基金(2025-BS-0485)

PDF(2491 KB)

Accesses

Citation

Detail

段落导航
相关文章

/