随着高集成技术、微电子封装技术、大功率LED技术以及超级计算机的迅猛发展，小型化、微型化与轻薄化成为现代及未来电子设备、电子电路的发展潮流，因此对散热要求越来越高。目前电子器件及设备主要应用导热硅脂、导热硅胶及复合材料来实现散热。若在器件及设备上制备一层具有高热导率、耐腐蚀、结合强度良好的导热涂层，可以更好地实现散热。从高导热涂层的应用背景及导热涂层的特点出发，阐述了制备方法和材料体系不同的三大类高导热涂层，重点介绍了以喷涂技术、磁控溅射技术、涂料技术制备高导热涂层的研究进展。对比这几种导热涂层制备技术可以发现，因为空气是热的不良导体，基于冷喷涂技术制备的涂层孔隙率低的特点，加之对涂层进行热处理后会更加致密，所以冷喷涂技术制备的导热涂层具有较高的热导率。但目前的喷涂粉末具有导电性，因此喷涂在电路及电器设备上应用还不够成熟。基于冷喷涂技术制备绝缘、高导热涂层，提高器件设备的导热性能，还有待进一步探索。

With the rapid development of highly integrated, microelectronic packaging, high power LED and supercomputers technologies, the electronic equipment and circuits characterized with miniaturization, micromation and lightweight lead a trend in modern time and coming days. Therefore, a better performance on heat dissipation is urgently needed. Nowadays, most electronic devices and equipment extract heat through the application of thermally conductive silicone grease, thermally conductive silicone gel and composite materials. If a layer of thermal conductive coating with high thermal conductivity, corrosion resistance and good bond strength is prepared on devices and equipment, it will achieve a better heat dissipation. Starting from the application of high thermal conductivity coatings and its features is explored, and forth three types of high thermal conductivity coatings with different preparation methods and material systems, the research progress of preparing high thermal conductivity coating by spraying technology, magnetron sputtering technology and coatings technology are introduced. Comparing with these thermal conductivity coatings prepared by different techniques, it can be found that the coatings prepared by cold spray technology has a higher thermal conductivity, because the air is a poor conductor of heat, and coatings prepared by cold spraying technology has a low porosity. Furthermore, it will be denser after heat treatment. However, the spraying powder is still conductive. So need to make further study on insulating and high thermal conductivity coatings based on cold spray technology in order to improve the thermal conductivity of devices and equipment.