摘要
首先从成键结构的角度分析了 DLC 薄膜摩擦性能的由来,然后分别从 DLC 薄膜的沉积工艺(包括制备方法、气源种类和掺杂元素)、摩擦环境条件和基底材料选择等三方面入手,讨论了影响 DLC 薄膜摩擦性能的主要因素及其影响规律。 经过总结发现,通过调节 DLC 薄膜的沉积工艺可以改变 DLC 薄膜中 sp2 杂化碳的含量以及氢的含量,进而影响 DLC 薄膜的摩擦性能;真空、惰性气体和低湿环境有利于获得更好的摩擦效果;过渡层和偏压有利于提高 DLC 薄膜与基底之间的附着力,其摩擦性能也会得到提升。 最后对 DLC 薄膜在机械加工及耐磨器件、光学和电子保护以及生物医学领域的应用进行了综述,并对应用过程中存在的两大问题— — —DLC 薄膜的内应力和热稳定性进行了分析,归纳了一些具体的解决方案,并对 DLC 薄膜的发展趋势进行了展望。
Abstract
First of all, the origin of the DLC film friction performance was analyzed from the point of bonding structure, and then the main factors of friction properties of diamond films and the influencing law were discussed from the three aspects: deposition process of DLC films (including the preparation method, the type of the gas source and doping elements), friction environmental conditions and substrate materials. It was concluded that: the content of sp2 in the carbon and the hydrogen content in the DLC film could be changed by adjusting the deposition process of DLC films, and then the tribological properties of the DLC films were influenced; vacuum, inert gas and low humidity environment were beneficial to better friction performance; the transition layer and the bias could improve the adhesion between the DLC film and the substrate, and enhance the friction performance. At last, the paper reviewed the applications of DLC films in mechanical processing and wear resistance, optical and electronic protection, analyzed the two major problems in the application process, namely, the internal stress and thermal stability of DLC film, and summarized the corresponding solutions. The development trend of DLC films was prospected as well.
关键词
类金刚石薄膜; 摩擦性能; 摩擦系数; 固体润滑薄膜; 附着力
Key words
diamond-like carbon film;tribological properties; friction coefficient;solid lubricating film; adhesion
熊礼威, 彭环洋, 张莹, 汪建华, 崔晓慧.
类金刚石薄膜的摩擦性能及其应用[J]. 表面技术. 2016, 45(1): 80-88
XIONG Li-wei, PENG Huan-yang, ZHANG Ying, WANG Jian-hua, CUI Xiao-hui.
Tribological Properties and Application of Diamond-like Carbon Film[J]. Surface Technology. 2016, 45(1): 80-88
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基金
国家自然科学基金项目(51402220);武汉工程大学青年基金(Q201401)