目的 (Ti,Cu)N 薄膜是一种新型的硬质涂层材料,关于其结构和性能的研究报道还较少。 研究脉冲偏压对 (Ti,Cu)N 薄膜结构与性能的影响规律,以丰富该研究领域的成果。 方法 将多弧离子镀和磁控溅射离子镀相结合构成复合离子镀技术,采用该技术在不同脉冲偏压下于高速钢基体表面制备(Ti,Cu)N 薄膜。 分析薄膜的微观结构,测定沉积速率及薄膜显微硬度,通过摩擦磨损实验测定薄膜的摩擦系数。 结果 在不同偏压下获得的(Ti,Cu)N 薄膜均呈晶态,具有(200)晶面择优取向,当脉冲偏压为-300 V 时,薄膜的择优程度最明显。 随着脉冲偏压的增加,薄膜表面大颗粒数量减少且尺寸变小,表面质量提高;沉积速率呈现先增大、后减小的趋势,在脉冲偏压为-400 V 时最大,达到 25. 04 nm/ min;薄膜硬度也呈现先增大、后减小的趋势,在脉冲偏压为-300 V 时达到最大值 1571. 4HV。 结论 脉冲偏压对复合离子镀(Ti,Cu)N 薄膜的表面形貌、择优取向、沉积速率和硬度均有影响。

Objective There are few reports on the microstructure and properties of (Ti,Cu)N thin film, which is a new type of hard coating. This work investigated the effects of pulsed bias on the structure and properties of (Ti,Cu)N film, enriching research results of this area. Methods The hybrid ion plating technique, realized by simultaneously using arc ion plating and magnetron sputtering, was employed to deposit (Ti,Cu)N film samples onto high-speed steel under different pulsed biases. Surface morphology, crystalline structure, thickness, micro-hardness as well as friction coefficient of the coatings were measured respectively. Results All the films were crystalline in spite of the varying bias. The (Ti,Cu)N coatings deposited at -300 V had the most obvious preferred plane (200). Both the quantity and the size of the macro-particles on the film surface became smaller with the increasing pulsed bias, presenting an improved surface quality. Deposition rate of the ( Ti,Cu) N film increased first and then decreased with increasing pulsed bias, and the maximum deposition rate, 25. 04 nm / min, was achieved at a pulsed bias of -400 V. Micro-hardness of the films changed similarly to the deposition rate with the varying pulsed bias, and it reached the maximum value of 1571. 4HV at -300 V. Conclusion The pulsed bias had an obvious influence on the surface morphology, crystalline orientation, deposition rate and microhardness of (Ti,Cu)N films.