PDF(5022 KB)
Thick Titanium Interlayer Remitting Stress in Diamond Films Deposited on Copper Substrate by Hot Filaments Chemical Vapor Deposition
ZHAO Qi, DAI Ming-jiang, WEI Chun-bei, QIU Wan-qi, HOU Hui-jun, TAN Di
Surface Technology ›› 2013, Vol. 42 ›› Issue (5) : 19-23.
PDF(5022 KB)
PDF(5022 KB)
Thick Titanium Interlayer Remitting Stress in Diamond Films Deposited on Copper Substrate by Hot Filaments Chemical Vapor Deposition
diamond films; titanium interlayer; internal stress; hot filaments chemical vapor deposition
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