PDF(3407 KB)
Effect of Technological Condition on Resistance of Electroplating Tin Solution Based on BAg50 CuZn Brazing Filler Metal
WANG Xing-xing, LONG Wei-min, LYU Deng-feng, BAO Li, QI Jian-zhao, SUN Hua-wei
Surface Technology ›› 2013, Vol. 42 ›› Issue (4) : 76-78,118.
PDF(3407 KB)
PDF(3407 KB)
Effect of Technological Condition on Resistance of Electroplating Tin Solution Based on BAg50 CuZn Brazing Filler Metal
BAg50 CuZn brazing filler metal; electroplating tin; electrolyte resistance; ultrasonic
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