The Research of Boron-doped and Phosphorus-doped Nanocrystalline Silicon Films and Application in Analogue Tandem Solar Cells

SUN Yue-feng, ZHANG Wei-jia, SONG Deng-yuan, LIU Jia, ZHANG Lei, MA Qiang, WU Ran-song, ZHANG Leng

Surface Technology ›› 2013, Vol. 42 ›› Issue (3) : 5-8.

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PDF(3479 KB)
Surface Technology ›› 2013, Vol. 42 ›› Issue (3) : 5-8.
Research and Exploration

The Research of Boron-doped and Phosphorus-doped Nanocrystalline Silicon Films and Application in Analogue Tandem Solar Cells

  • SUN Yue-feng1, ZHANG Wei-jia1, LIU Jia1, MA Qiang1, WU Ran-song1, ZHANG Leng1, SONG Deng-yuan2, ZHANG Lei2
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Abstract

Boron-doped and phosphorus-doped thin films ( nc-Si : H) were deposited by RF-PECVD system and applied to fabricate analogue tandem solar cells. The optical performance and morphology of the thin film sample were analyzed. The results showed that the optical band gap, conductivity, hall mobility and carrier concentration of P-type nc-Si : H thin films were 2 . 189 eV, 8 . 01 S / cm, 0 . 521 cm2/ ( V·S) and 9 . 61 X1019/ cm3, respectively and those of N-type nc-Si : H thin films were 1 . 994 eV,1 . 93 S / cm, 1 . 694 cm2/ ( V·S) and 7 . 113 X1018/ cm3, respectively. Nanocrystalline grain size was approximate 3 ~5 nm and crystal volume fraction was within 35 % ~ 45 % . The grain deposition was density and it had more uniform size. The analogue tandem solar cells with the structure of Al / AZO / p-nc-Si : H / i-nc-Si : H / n-nc-Si : H / p-nc-Si : H / i-nc-Si : H / n-c-Si / Al were prepared in an area of 20 mmX20 mm and achieved the maximum open-circuit voltage VOC, short-circuit current ISC and fill factor of 544 . 3 mV, 85 . 6 mA and 65 . 7 % , respectively.

Key words

RF-PECVD; Boron-doped; phosphorus-doped; nanocrystalline silicon film; analogue tandem solar cell

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SUN Yue-feng, ZHANG Wei-jia, SONG Deng-yuan, LIU Jia, ZHANG Lei, MA Qiang, WU Ran-song, ZHANG Leng. The Research of Boron-doped and Phosphorus-doped Nanocrystalline Silicon Films and Application in Analogue Tandem Solar Cells[J]. Surface Technology. 2013, 42(3): 5-8
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