The Effect of Pre-Cu-plating on Aluminum Base for Ni Electrodeposited Layer

XIAO Yue-jun, ZHAO Wei, WANG Xue, LIAO Zhen-yu, HAN Xin-bo, LIU Qian, LIU Ji-wen, ZHANG Wen-liang, SONG Lin-hong

Surface Technology ›› 2013, Vol. 42 ›› Issue (2) : 80-83.

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PDF(3899 KB)
Surface Technology ›› 2013, Vol. 42 ›› Issue (2) : 80-83.
Applied Technology

The Effect of Pre-Cu-plating on Aluminum Base for Ni Electrodeposited Layer

  • XIAO Yue-jun, ZHAO Wei, WANG Xue, LIAO Zhen-yu, HAN Xin-bo, LIU Qian, LIU Ji-wen, ZHANG Wen-liang, SONG Lin-hong
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Abstract

In order to improve the performance of aluminum electrodeposited nickel layer, pre-copper plating process was adopted before electrodeposited nickel . The testing techniques such as SEM, EDS, scarification, helium mass spectrometer leak detection method were used to study performance of the phase composition and microstructure of pre-copper plating layer compared with immersion zinc layer, to study airtightness and combination of the deposited nickel layers. The results show that electrodeposited nickel layer performance has been significantly improved as the addition of the pre-copper plating, nickel layer surface is brighter, the airtightness is greatly improved.

Key words

pre-copper plating; aluminum base; electrodeposited; immersion zinc dip; nickel-plated

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XIAO Yue-jun, ZHAO Wei, WANG Xue, LIAO Zhen-yu, HAN Xin-bo, LIU Qian, LIU Ji-wen, ZHANG Wen-liang, SONG Lin-hong. The Effect of Pre-Cu-plating on Aluminum Base for Ni Electrodeposited Layer[J]. Surface Technology. 2013, 42(2): 80-83
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