Evaluation on Plating Stability in Electroless Nickel Deposition

CHEN Yue-hua, YUAN Li-hua, LIU Yong-yong, JIANG De-feng

Surface Technology ›› 2013, Vol. 42 ›› Issue (2) : 74-76.

PDF(2255 KB)
PDF(2255 KB)
Surface Technology ›› 2013, Vol. 42 ›› Issue (2) : 74-76.
Applied Technology

Evaluation on Plating Stability in Electroless Nickel Deposition

  • CHEN Yue-hua, YUAN Li-hua, LIU Yong-yong, JIANG De-feng
Author information +
History +

Abstract

Based on the action mechanism of electroless nickel deposition, the factors affecting the stability of the plating solution, such as salinity ( nickelous sulfate and sodium hypophosphite ) , pH value, temperature and operating methods were analyzed. It is indicated that when the concentration of Nickel and hypophosphite acid is 5 . 8 g / L and 17 . 4 g / L respectively, and pH value is 4 . 4 , the best plating stability can be achieved under 82 ℃ .

Key words

electroless Ni plating; bath stability; deposition rate

Cite this article

Download Citations
CHEN Yue-hua, YUAN Li-hua, LIU Yong-yong, JIANG De-feng. Evaluation on Plating Stability in Electroless Nickel Deposition[J]. Surface Technology. 2013, 42(2): 74-76
PDF(2255 KB)

Accesses

Citation

Detail

Sections
Recommended

/