The replacement copper plating on the phosphating film was carried out in copper sulfate solution. The results showed that it爷 s feasible to plate copper on phosphating film. After plating the strength and the corrosion resistance of the as-prepared phosphating film can be increased. The time of the plating should be short and the concentration of the copper sulfate should be low. The suggested experiment parameters are listed as follows: the concentration of copper sulfate is 2 % , the temperature is room temperature and the time is 3 ~ 5 min.