An advanced etching agent that contains Potassium Monopersulfate,phosphoric acid and stabilizing agent is introduced in this paper and the effect factors such as the temperature,concentration,copper content were studied during the etching process. The result indicates that the effect of the temperature on etching rate is great, and the optimum temperature is between 37 ℃~43 ℃, not too high or too low; the phosphoric acid between 1. 6% to 2% is more helpful for etching and stabilized the pH value,improved the effect of the treatment in the presence of the stabilizers; PPS content between 50 ~100 g/ L is appropriate and flexible to control the etching rate; with the increase of copper content, more microetch solution must be continually added in order to maintain the required etching rate due to it爷s great impact. This etching system is more controllable etching rate and more stable than traditional H2 SO4 / H2 O2 ,SPS/ H2 SO4 and Potassium Monopersulfate-sulfuric acid etching system to meet the request of increased roughness and low etching rate.