A new high temperature resistant adhesive that was epoxy resin modified by silicone resin and KH560 modified nano-SiO2 and reinforced by inorganic filler (aluminum powder, glass powder, boron carbide) was prepared for bonding ceramic (Al2 O3 ) materials. The analysis of IR and TG shows that the adhesive can be cured at 65 ℃and has good heat resistance. Through orthogonal experiment, it optimizes the ratio of every raw material. The adhesive which was prepared according to the optimum experiment ratio can bond ceramic (Al2 O3 ) joints well, and the compressive shear strength of ceramic joints can reach 9. 68 MPa after heat treatment at 1000 ℃.