It studied the additive for electroless copper plating taking potassium sodium tartrate as complexing agen, and discussed the effect of CH3OH,K4[Fe(CN)6]·3H2O,2,2’-bipyridine on the stability of plating bath, the quality of electroplating layer, the deposition rate of plating, to determine the amount of additive. The results indicate that the optimal conditions of the electroless copper plating system as follows: CH3OH is 14 ml/L,K4[Fe(CN)6]·3H2O is 30 mg/L,2,2’-bipyridine is 5 mg/L,plating 30 min in the bath, the copper deposition rate reaches 4.6 μm/h,electroplating layer appears shiny pale pink, and stability of plating bath is optimal, electroplating layer has good adhesion.