Research status and Prospect of Chemical Mechanical Polishing Slurry

PENG Jin, XIA Lin, ZOU Wen-jun

Surface Technology ›› 2012, Vol. 41 ›› Issue (4) : 95-98.

Surface Technology ›› 2012, Vol. 41 ›› Issue (4) : 95-98.
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Research status and Prospect of Chemical Mechanical Polishing Slurry

  • PENG Jin, XIA Lin, ZOU Wen-jun
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Abstract

The main composition and function of chemical mechanical polishing(CMP)slurry were elaborated. The developing status of CMP surry in recent years was summarized. It mainly introduced SiO2 sol polishing slurry, Al2O3 polishing slurry, CeO2 polishing slurry, nanodiamond polishing slurry. Finally, the research trends of CMP slurry were pointed out which were environmental protection, refinement, hyperspecialization.

Key words

CMP slurry; SiO2; Al2O3; CeO2; Nanodiamond

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PENG Jin, XIA Lin, ZOU Wen-jun. Research status and Prospect of Chemical Mechanical Polishing Slurry[J]. Surface Technology. 2012, 41(4): 95-98

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