
  Action Plan for China's Sci-Tech Journals
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The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating
XING Fang-fang, CHENG Yan-hai, ZHANG Shi-ju, CHEN Heng-yang
Surface Technology ›› 2012, Vol. 41 ›› Issue (4) : 7-9.
The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating
electroless plating; Ni-W-P alloy coating; plating rate;surface morphology
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