Study on the Preparation of Cu-coated SiC Particles by Electroless Plating

ZHAO Dan, SONG Hong-zhang, SUN Hong-wei, HU Xing, YANG De-lin

Surface Technology ›› 2012, Vol. 41 ›› Issue (3) : 105-108,129.

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PDF(5390 KB)
Surface Technology ›› 2012, Vol. 41 ›› Issue (3) : 105-108,129.
Applied Technology

Study on the Preparation of Cu-coated SiC Particles by Electroless Plating

  • ZHAO Dan, SONG Hong-zhang, SUN Hong-wei, HU Xing, YANG De-lin
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Abstract

Copper coated SiC particles were prepared by the electroless plating method. The influence of pretreatment, the plating solution component, the pH value and loadage on the Cu layer were analyzed. Furthermore, the effects of adjusting the content of sulfate and the loadage on controlling the copper content in the composite powder were compared .The phase, morphology and component of powder were analyzed with XRD,SEM and EDS to obtain the optimum plating process. The results show that the uniform Cu coat can be obtained only when the activating solution for pretreatment deposited for some time; Along with the pH value and the sulfate content increases, the speed of plating increases, but the cladding perfection and uniformity of powder reduces; Adjusting the loadage is a better way to control the content of copper in composite powder.

Key words

electroless copper plating; SiC particals; pretreatment; plating speed; copper content

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ZHAO Dan, SONG Hong-zhang, SUN Hong-wei, HU Xing, YANG De-lin. Study on the Preparation of Cu-coated SiC Particles by Electroless Plating[J]. Surface Technology. 2012, 41(3): 105-108,129
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