Study on Sulphamate Iron Plating on Aluminum Substrate as Nickle Substitute

WANG Ming-hao, ZHOU Chao-liang, XIE Lei, HU Jin, LI Ning

Surface Technology ›› 2012, Vol. 41 ›› Issue (3) : 100-104.

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PDF(4570 KB)
Surface Technology ›› 2012, Vol. 41 ›› Issue (3) : 100-104.
Applied Technology

Study on Sulphamate Iron Plating on Aluminum Substrate as Nickle Substitute

  • WANG Ming-hao1, LI Ning1, ZHOU Chao-liang2, XIE Lei2, HU Jin2
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Abstract

Aiming at lowering the cost and reducing the pollution in solderable electroplating process of aluminum substrate, the technology of iron plating in ferrous sulphamate bath system as nickle substitute after zincation process was achieved. Technical conditions such as bath pH, operating temperature and bath compositions were optimized through Hull cell test. The adhesion, corrosion behavior and solderability of the corresponding coatings acquired in the optimum conditions were characterized respectively. It indicates that sulphamate iron platingtechnology could achieve well coating adhesion and solder wetting ability of tin-plating layer though the anti-corrosion behavior is not so good.

Key words

aluminum; iron plating; sulphamate; nickle substitute; solderability

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WANG Ming-hao, ZHOU Chao-liang, XIE Lei, HU Jin, LI Ning. Study on Sulphamate Iron Plating on Aluminum Substrate as Nickle Substitute[J]. Surface Technology. 2012, 41(3): 100-104
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