Silver planting on the surface of red copper was obtained by using silver nitrate as main salt, ethylene-diamine as complexant and ethanol as solvent. Variation of mean deposition rate for immersion silver along with plating time was investigated. Each reaction order and the apparent activation energy were obtained by linear-fitting of the relation curve between deposition rate and silver ion concentration, amount of ethylenediamine, temperature of the solution, the pH value and amount of ethanol. Kinetics equations of deposition rate were got and be verified.