By the method of orthogonal experiment, 9 NiCr-NiSi thin-film thermocouples with different properties were prepared on the rake face of different cutting tools, and orthogonal test was conducted with four factors sputtering power, sputtering time, sputtering pressure and substrate negative bias. The adhesion between the thin-film and the cutting tool were tested, and the results was analyzed by range analysis. It show that, among the four sputtering factors, substrate bias is the most important factor which influences thin-film adhesion. In a certain range, increasing the substrate negative bias voltage can enhance the thin-film adhesion. Subsequently, the range analysis result was verified by test. The experiment indicates that NiCr thin-film sputtering parameters are selected as sputtering power(90 W), sputtering time(30 min), sputtering pressure(0.45Pa), substrate bias(-110V). NiSi thin-film sputtering parameters are selected as sputtering power(100 W), sputtering time(40 min), sputtering pressure(0.4 Pa), substrate bias(-110V). As a result, the adhesion of NiCr and NiSi film increases 3.2 N and 1.5 N around individually.