Numerical Simulation and Process Parameter Optimization of Fluid-Solid Coupling in CMP of Fused Silica

LI Mengjuan; GUO Wen

doi:10.16490/j.cnki.issn.1001-3660.2026.19.009

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Surface Technology ›› 2026, Vol. 55 ›› Issue (19) : 96-107. DOI: 10.16490/j.cnki.issn.1001-3660.2026.19.009

Precision and Ultra-precision Machining

Numerical Simulation and Process Parameter Optimization of Fluid-Solid Coupling in CMP of Fused Silica

LI Mengjuan¹, GUO Wen²

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Abstract

Fused silica is a typical hard-brittle material widely used in high-end optical and semiconductor systems, where near-atomic-scale surface quality and minimal subsurface damage (SSD) are critically required. However, conventional processing methods often induce surface defects and subsurface cracks, limiting performance. Chemical mechanical polishing (CMP) provides a promising solution, yet the underlying material removal mechanism, particularly the coupling effects among slurry flow, abrasive motion, and pad-workpiece contact, remains insufficiently understood. The work aims to achieve an atomically smooth surface on fused silica while suppressing SSD, and to clarify the removal mechanism based on fluid-solid coupling modeling and experimental validation.
To overcome the limitations of conventional finite element approaches that neglected slurry lubrication and load-bearing effects, a fluid-solid coupling model wasestablished with the Euler-Lagrange coupling method implemented in ABAQUS/Explicit. This framework enabled simultaneous characterization of fluid behavior and solid deformation during CMP. A polishing slurry consisting of CeO₂ abrasives, Arabic gum, γ-aminobutyric acid, and deionized water was formulated. Single-factor experiments were conducted to systematically investigate the effects of abrasive concentration, pH value, and polishing pressure on material removal rate (MRR) and surface roughness (Sa). Furthermore, transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS) were employed to characterize subsurface damage evolution and surface chemical states. The combination of numerical simulation and experimental characterization allowed for a multi-scale interpretation of the material removal mechanism.
Under optimized process conditions, the surface roughness (Sa) of fused silica was significantly reduced from 0.745 nm to 0.158 nm (50 μm×50 μm), achieving a near-atomic-scale (atomically smooth) surface free of scratches and pitting defects. Meanwhile, the thickness of the subsurface damage layer decreased from 10.7 nm to 4.1 nm, indicating effective suppression of SSD. The experimentally measured material removal rate showed a clear dependence on process parameters, consistent with simulation predictions. Numerical results revealed that the interfacial stress evolved dynamically from discrete localized high-stress points to a more uniform and continuous distribution, indicating a transition from point contact to stable mixed contact. The average interfacial stress was maintained within 0.1-1 MPa, demonstrating the buffering and load-carrying role of the slurry film. Additionally, XPS analysis indicated that the surface chemical environment became more homogeneous after polishing, with reduced defect states and a more uniform Si bonding configuration. These results collectively confirmed that the CMP process wasgoverned by a synergistic material removal mechanism, involving chemically induced surface modification and mechanically assisted removal.
This work establishes a robust Euler-Lagrange-based fluid-solid coupling framework for analyzing the CMP process of fused silica and provides direct experimental validation of its predictive capability. The results demonstrate that achieving an optimal balance between hydrodynamic lubrication and mechanical contact is essential for realizing high-efficiency material removal, atomically smooth surfaces, and reduced subsurface damage. The combined numerical-experimental approach clarifies the material removal mechanism from both mechanical and chemical perspectives, revealing the critical role of stress distribution evolution and surface chemical regulation. The proposed model and optimized process window provide theoretical guidance and practical strategies for ultra-precision polishing of hard-brittle materials, enabling deterministic control of surface integrity in advanced optical manufacturing.

Key words

chemical mechanical polishing / fused silica / fluid-solid coupling modeling / euler-Lagrange coupling method / subsurface damage / atomically smooth surface / material removal mechanism

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LI Mengjuan, GUO Wen. Numerical Simulation and Process Parameter Optimization of Fluid-Solid Coupling in CMP of Fused Silica[J]. Surface Technology. 2026, 55(19): 96-107

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