Research Progress on Anti-plating Creep Coatings for Multilayer Chip Electronic Components

WU Mengyu; LI Yanfei; LIU Zhiwen; LI Yaling; YUAN Junxia; YANG Lixia

doi:10.16490/j.cnki.issn.1001-3660.2026.10.014

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Surface Technology ›› 2026, Vol. 55 ›› Issue (10) : 163-181. DOI: 10.16490/j.cnki.issn.1001-3660.2026.10.014

Functional Surfaces and Technology

Research Progress on Anti-plating Creep Coatings for Multilayer Chip Electronic Components

WU Mengyu¹, LI Yanfei², LIU Zhiwen¹, LI Yaling³, YUAN Junxia¹, YANG Lixia^1,*

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Abstract

The miniaturization and integration of multilayer chip electronic components (MLCCs, MLCIs, MLCVs) are critical for advanced applications in 5G, electric vehicles, and aerospace. A major reliability challenge in these components is "plating creep", a defect occurring during termination electrode electroplating, where metal ions migrate laterally from the electrode edge onto the ceramic body. This unwanted metallic deposition degrades electrical performance, compromises solderability and causes short circuits. Insulating coatings have emerged as the primary solution, acting as a physical barrier to prevent metal ion reduction and ceramic hydrolysis.
This review systematically examines the mechanisms behind plating creep and the coating strategies developed to resolve plating creep. The defect originates from residual metal ions present on the sintered ceramic surface and reduced by active hydrogen generated during the cathodic electroplating process. The core of the discussion provides a comprehensive comparative analysis on the two primary categories of protective coatings: inorganic non-metallic coatings and organic polymer coatings. Inorganic coatings, encompassing glass-based systems, phosphate conversion films, and ceramic oxides, are characterized by exceptional thermal stability, high hardness, superior chemical resistance, and excellent barrier properties. However, their application is often constrained by high processing temperatures, inherent brittleness, environmental concerns with certain formulations, and challenges in depositing uniform thin films on increasingly miniaturized geometries. In contrast, organic polymer coatings, such as silicone resins, epoxy resins, and polyimides (PI), offer distinct advantages in processing versatility, adhesion, flexibility, and lower-temperature curing. Organosilicones excel in thermal stability and hydrophobicity, epoxy resins are favored for their strong adhesion and cost-effectiveness, while polyimides represent the high-performance benchmark with outstanding thermal endurance and mechanical strength. The general limitations of organic systems include higher moisture absorption rates, potential chemical degradation in acidic plating environments, and with the exception of high-performance PIs, these systems have limited tolerance to soldering temperatures and prolonged thermal exposure.
A detailed evaluation of key service performance parameters is central to assessing coating efficacy and longevity. These parameters include heat resistance, which is crucial for withstanding reflow soldering and high-temperature operation, corrosion resistance essential for enduring aggressive electroplating baths, wear resistance required to withstand mechanical abrasion during dynamic processing, water absorption rate, a critical factor affecting dimensional stability and long-term insulation, long-term stability under coupled hygrothermal and thermomechanical stresses and the coating-substrate adhesion strength, which directly determines the coating's resistance to delamination and its overall reliability. The performance in these areas is fundamentally governed by the coating's material composition, key microstructural features like crosslink density and filler incorporation, and the quality of its interfacial adhesion with the ceramic substrate.
Future research is directed toward several pivotal avenues to overcome current limitations. This entails a deeper fundamental investigation into coating failure mechanisms during cathodic electrodeposition, focusing on ion penetration, polymer swelling, and interfacial delamination in operational environments. The development of advanced organic-inorganic hybrid or nanocomposite coatings is promising, aiming to synergistically combine the robustness of ceramics with the toughness and processability of polymers. There is also a growing need for enhanced predictive modeling of coating longevity, establishing quantitative relationships between accelerated aging tests, microstructural evolution, and macro-performance degradation to enable reliable service-life prediction. Concurrently, the field must continue to emphasize environmentally benign materials, such as fully lead-free and low-VOC systems, alongside the development of high-precision, scalable coating application techniques compatible with next-generation micro-component geometries. This review is expected to provide a theoretical foundation for developing next-generation, high-performance anti-plating creep coatings to ensure the enhanced reliability of multilayer chip electronic components.

Key words

multilayer chip electronic components / anti-plating creep / inorganic non-metallic coating / organic polymer coating / service performance

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WU Mengyu, LI Yanfei, LIU Zhiwen, LI Yaling, YUAN Junxia, YANG Lixia. Research Progress on Anti-plating Creep Coatings for Multilayer Chip Electronic Components[J]. Surface Technology. 2026, 55(10): 163-181

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