Practice has shown that when semiconductor silicon materials operate under high-speed, heavy-load or harsh working conditions in a micro/nano electromechanical system, the mating surfaces such as transmission meshing, hub connection, and pin connection often experience adhesive contact failures, which weaken the interface contact performance and are highly susceptible to the coupling effects of flash temperature points, adhesion forces, surface/interfaces effects, quantum effects. If we can understand or suppress the adhesion generation on interface from a nanoscale perspective, it will have significant scientific research significance on extending the durability service life of silicon devices in micro/nano electromechanical system semiconductors.
At present, this research on the adhesion behaviour at the interface of micro/nano electromechanical systems mainly relies on molecular dynamics simulation and micro/nano precision instrument testing methods. The micro/nano experimental testing methods are extremely costly in terms of both human resources and financial resources, while MD is favored by researchers due to its powerful computing capabilities, which enable it to simulate systems that are consisted by hundreds of millions of atoms. To reduce the adhesion generated at the interface of semiconductor silicon in micro-electromechanical systems, a physical model at the atomic scale between a regular triangular pyramid probe and silicon surfaces coated with graphene and graphdiyne films is established accordingly. Based on the nanoindentation method, the differences on the nano-adhesive contact behavior of graphene and graphdiyne films coated on silicon surfaces are compared. The influence of the number of coated films on the load-displacement curve, shear deformation, displacement amplitude, stress distribution, total dislocation length, and adhesive effect is mainly analyzed. Research indicates that silicon-based surfaces coated with graphene films and graphdiyne films not only effectively enhance the load-bearing capacity of the silicon substrate, but also show a stronger load-bearing capacity as the number of films increases.
This research finds that the silicon-based surface coated with graphene films and graphdiyne films can effectively reduce the adhesion effect. The adhesion effect produced by the silicon-based surface covered with graphdiyne films is significantly lower than that of graphene films, and as the number of films increases, the adhesion effect gradually decreases. Furthermore, the research shows that the intensity of shear deformation and atomic displacement on silicon-based surfaces is highly dependent on the number of graphene and graphdiyne films on the silicon surface. The main manifestation is as follows: As the number of graphene films and graphdiyne films increases, the stiffness of films is enhanced. The size of the fracture gap generated under load is positively correlated with the shear deformation of the silicon substrate surface and the amplitude of atomic displacement. This research result provides new strategies and theoretical basis for avoiding the adhesion contact failure in micro-electromechanical system semiconductor devices.
Key words
nano adhesive /
semiconductor Si /
graphene films /
graphdiyne films /
molecular dynamics
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Funding
National Natural Science Foundation of China (62563030); The Key Laboratory Project of AI Non-destructive Phenotypic Measurement Technology and Equipment in Nanchang City; Science and Techno logy Research Project of Education Department of Jiangxi Province (GJJ2402616, GJJ2402609); School Project Supported by Nanchang Institute of Technology (NLZK2401, NLZK2406, NLZK2504)
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