Recent Progress in 1D Vertical Architecture-designed Thermal Interface Materials

CAO Hongtao; SUN Haowei

doi:10.16490/j.cnki.issn.1001-3660.2026.02.015

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Surface Technology ›› 2026, Vol. 55 ›› Issue (2) : 209-220. DOI: 10.16490/j.cnki.issn.1001-3660.2026.02.015

Functional Surfaces and Technology

Recent Progress in 1D Vertical Architecture-designed Thermal Interface Materials

CAO Hongtao, SUN Haowei^*

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Abstract

As high-power electronic devices continue to miniaturize and integrate, efficient thermal management has become a critical challenge in ensuring their reliable performance and longevity. Thermal interface materials (TIMs) are essential in addressing these challenges by providing a highly effective thermal conduction pathway between the heat source, typically the chip, and the heat sink. The ability of these materials to manage the heat flow is crucial for the operation of modern electronic devices, such as microprocessors, LEDs, and power electronics, which are characterized by high power densities and compact form factors. This paper provides a comprehensive review of recent advancements in the development of high-efficiency thermal interface materials, particularly focusing on three categories of vertically aligned nanostructured materials: metal nanowire arrays, carbon fiber composites, and carbon nanotube arrays.
The first category of metal nanowire arrays has garnered significant attention due to the potential of copper nanowires to provide excellent thermal conductivity. Copper has high thermal and electrical conductivity, making it an ideal candidate for use in TIMs. A comparative analysis of various fabrication methods, such as electrochemical deposition and template-assisted growth, reveals significant differences in the alignment and orientation of the nanowires, which play a critical role in determining the thermal performance of the material. These fabrication methods influence the uniformity of the nanowire arrays, and thus, their ability to create an efficient thermal pathway from the chip to the heat sink. Understanding these influences and optimizing the fabrication processes are crucial steps for improving the efficiency of metal nanowire-based TIMs.
The second category of TIMs discussed in this paper focuses on vertically aligned carbon fiber composites. Carbon fibers, particularly those with high aspect ratios, have shown promise in improving the thermal conductivity of TIMs. These materials benefit from the exceptional thermal properties of carbon and the unique alignment of fibers that enhances heat transfer efficiency. The optimization of the carbon fiber structure and its interface properties is critical in reducing the overall thermal resistance. Research shows that phonon matching at the interface between the carbon fibers and the surrounding materials plays a pivotal role in improving heat dissipation. By fine-tuning the fiber alignment, aspect ratio, and interfacial properties, researchers are able to significantly enhance the thermal performance of carbon fiber-based TIMs.
The third category explored in this review focuses on vertically aligned carbon nanotube (CNT) arrays. CNTs are well-known for their extraordinary thermal and mechanical properties, and their vertical alignment is particularly advantageous for efficient heat transfer. These arrays are typically synthesized by metal-catalyzed chemical vapor deposition (CVD), which allow for precise control over the alignment and density of the CNTs. A major challenge with CNT-based TIMs is improving the interfacial quality between the nanotubes and the surrounding materials. Studies demonstrate that reducing the thermal resistance at the CNT interface can significantly enhance the overall thermal conductivity of the material. Various strategies, such as incorporating filling materials into the CNT arrays and optimizing the transfer process of the CNT array materials, have been explored to address this challenge. Additionally, the incorporation of filling materials has been shown to further enhance the thermal conductivity of CNT arrays, making them even more effective as TIMs.
Overall, the advancements in these three categories of vertically aligned nanostructured thermal interface materials provide significant insights into the future of thermal management for high-performance electronic devices. By optimizing the structure, alignment, and interfacial properties of these materials, researchers are developing new solutions that can meet the increasingly demanding thermal management requirements of next-generation electronics. These studies offer both theoretical and practical guidance for the design of high-performance TIMs that can effectively address the heat dissipation challenges posed by modern electronic devices. The continued development of these materials promises to pave the way for more efficient, reliable, and compact electronic systems.

Key words

thermal interface materials / vertically aligned nanostructures / metal nanowire arrays / vertically aligned carbon fiber composites / vertically aligned carbon nanotube arrays

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CAO Hongtao, SUN Haowei. Recent Progress in 1D Vertical Architecture-designed Thermal Interface Materials[J]. Surface Technology. 2026, 55(2): 209-220

References

[1] 郭华超, 王良旺, 郭志强, 等. 高导热聚合物/石墨烯热界面材料研究进展[J]. 化工新型材料, 2024, 52(9): 1-6.
GUO H C, WANG L W, GUO Z Q, et al.Research Progress of Polymer/Graphene Thermal Interface Materials with High Thermal Conductivity[J]. New Chemical Materials, 2024, 52(9): 1-6.
[2] LEISERSON C E, THOMPSON N C, EMER J S, et al. There’s Plenty of Room at the Top: What Will Drive Computer Performance after Moore’s Law?[J]. Science, 2020, 368(6495): eaam9744.
[3] 虞锦洪. 高导热聚合物基复合材料的制备与性能研究[D]. 上海: 上海交通大学, 2012.
YU J H.Study on preparation and properties of polymer- based composites with high thermal conductivities[D]. Shanghai: Shanghai Jiao Tong University, 2012.
[4] 韩蒙蒙, 张阔, 李敬. 有机硅基热界面材料的研究进展[J]. 有机硅材料, 2023, 37(6): 73-78.
HAN M M, ZHANG K, LI J.Research Progress of Silicone-Based Thermal Interface Materials[J]. Silicone Material, 2023, 37(6): 73-78.
[5] WEN Y F, CHEN C, YE Y S, et al.Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials—A Review[J]. Advanced Materials, 2022, 34(52): 2201023.
[6] 刘晓云, 许达善, 李倩, 等. 金属基热界面材料研究进展[J]. 沈阳理工大学学报, 2023, 42(1): 42-48.
LIU X Y, XU D S, LI Q, et al.Research Progress of Metal Thermal Interface Materials[J]. Journal of Shenyang Ligong University, 2023, 42(1): 42-48.
[7] DAI W, WANG Y D, LI M H, et al.2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications[J]. Advanced Materials, 2024, 36(37): 2311335.
[8] BURGER N, LAACHACHI A, FERRIOL M, et al.Review of Thermal Conductivity in Composites: Mechanisms, Parameters and Theory[J]. Progress in Polymer Science, 2016, 61: 1-28.
[9] 张信峰. 复合热界面材料导热强化机理及定向调控方法研究[D]. 武汉: 华中科技大学, 2024.
ZHANG X F.Research on the Thermal Conductivity Enhancement Mechanism and Directional Regulation Method of Composite Thermal Interface Materials[D]. Wuhan: Huazhong University of Science and Technology, 2024.
[10] RUAN K P, SHI X T, GUO Y Q, et al.Interfacial Thermal Resistance in Thermally Conductive Polymer Composites: A Review[J]. Composites Communications, 2020, 22: 100518.
[11] 张金成, 冯一峻, 肖文军, 等. 填充型聚合物基导热复合材料的研究进展[J]. 杭州师范大学学报(自然科学版), 2019, 18(5): 476-482.
ZHANG J C, FENG Y J, XIAO W J, et al.On Filled Polymer-Based Thermal Conductive Composites[J]. Journal of Hangzhou Normal University (Natural Science Edition), 2019, 18(5): 476-482.
[12] ZHANG G R, XUE S, CHEN F, et al.An Efficient Thermal Interface Material with Anisotropy Orientation and High Through-Plane Thermal Conductivity[J]. Composites Science and Technology, 2023, 231: 109784.
[13] LU J H, MING X, CAO M, et al.Scalable Compliant Graphene Fiber-Based Thermal Interface Material with Metal-Level Thermal Conductivity via Dual-Field Synergistic Alignment Engineering[J]. ACS Nano, 2024, 18(28): 18560-18571.
[14] 何静. 不同维度导热材料的结构设计及其复合材料的制备与性能研究[D]. 合肥: 中国科学技术大学, 2021.
HE J.Structural design of thermal conductive material with different dimensions and research on the performance of fabricated composites[D]. Hefei: University of Science and Technology of China, 2021.
[15] NESBITT N T, NAUGHTON M J.A Review: Methods to Fabricate Vertically Oriented Metal Nanowire Arrays[J]. Industrial & Engineering Chemistry Research, 2017, 56(39): 10949-10957.
[16] FENG B, FARUQUE F, BAO P, et al.Double-Sided Tin Nanowire Arrays for Advanced Thermal Interface Materials[J]. Applied Physics Letters, 2013, 102(9): 093105.
[17] KHAN J, MOMIN S A, MARIATTI M.A Review on Advanced Carbon-Based Thermal Interface Materials for Electronic Devices[J]. Carbon, 2020, 168: 65-112.
[18] 杨斌, 孙蓉. 热界面材料产业现状与研究进展[J]. 中国基础科学, 2020, 22(2): 56-62.
YANG B, SUN R.The Current Industry Status and Research Progress in Thermal Interface Materials[J]. China Basic Science, 2020, 22(2): 56-62.
[19] 黄飞, 秦文波, 舒登峰, 等. 碳基填料填充型热界面材料的研究现状[J]. 高分子材料科学与工程, 2023, 39(1): 160-167.
HUANG F, QIN W B, SHU D F, et al.A State-of-the-Art Review of Thermal Interface Materials Laded with Carbon Based Filler[J]. Polymer Materials Science & Engineering, 2023, 39(1): 160-167.
[20] PING L Q, HOU P X, LIU C, et al.Vertically Aligned Carbon Nanotube Arrays as a Thermal Interface Material[J]. APL Materials, 2019, 7(2): 020902.
[21] LI J W, YE Z Q, MO P J, et al.Compliance-Tunable Thermal Interface Materials Based on Vertically Oriented Carbon Fiber Arrays for High-Performance Thermal Management[J]. Composites Science and Technology, 2023, 234: 109948.
[22] 戴书刚, 李金旺, 董传俊. 金刚石/铜高导热复合材料制备工艺的研究进展[J]. 精细化工, 2019, 36(10): 1995-2008.
DAI S G, LI J W, DONG C J.Research Progress on Preparation Methods of High Thermal Conductivity Diamond/Copper Composites[J]. Fine Chemicals, 2019, 36(10): 1995-2008.
[23] 刘雅轩, 侯佳乐, 李新乐, 等. 铜纳米线/高分子导热复合材料的研究进展[J]. 塑料科技, 2024, 52(10): 154-160.
LIU Y X, HOU J L, LI X L, et al.Research Progress of Copper Nanowire/Macromolecule Thermal Conductivity Composites[J]. Plastics Science and Technology, 2024, 52(10): 154-160.
[24] BARAKO M T, ROY-PANZER S, ENGLISH T S, et al.Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites[J]. ACS Applied Materials & Interfaces, 2015, 7(34): 19251-19259.
[25] BARAKO M T, ISAACSON S G, LIAN F F, et al.Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials[J]. ACS Applied Materials & Interfaces, 2017, 9(48): 42067-42074.
[26] GONG W, LI P F, ZHANG Y H, et al.Ultracompliant Heterogeneous Copper-Tin Nanowire Arrays Making a Supersolder[J]. Nano Letters, 2018, 18(6): 3586-3592.
[27] YI J, YUAN G M, LI X K, et al.Preparation and Characterization of Large Diameter Pitchbased Carbon Fiber/ABS Resin Composites with High Thermal Conductivities[J]. Carbon, 2015, 86: 373.
[28] LI Y, LU S W, SUN C N, et al.Variable Orientation in Material Extrusion of Short Carbon Fiber Reinforced Polymer Composites with High Thermal Conductivity[J]. Additive Manufacturing, 2024, 85: 104173.
[29] 王大林, 缪小冬, 杨宝岭, 等. 取向碳纤维/橡胶导热复合材料的研究进展[J]. 橡胶科技, 2023, 21(12): 577-581.
WANG D L, MIAO X D, YANG B L, et al.Research Progress in Oriented Carbon Fiber/Rubber Thermally Conductive Composites[J]. Rubber Science and Technology, 2023, 21(12): 577-581.
[30] UETANI K, ATA S, TOMONOH S, et al.Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking[J]. Advanced Materials, 2014, 26(33): 5857-5862.
[31] LU X H, LIU J, SHU C, et al.Densifying Conduction Networks of Vertically Aligned Carbon Fiber Arrays with Secondary Graphene Networks for Highly Thermally Conductive Polymer Composites[J]. Advanced Functional Materials, 2025, 35(11): 2417324.
[32] FU L Q, KONG N Z, HUANG M, et al.Compressible Thermal Interface Materials with High Through-Plane Thermal Conductivity from Vertically Oriented Carbon Fibers[J]. Journal of Alloys and Compounds, 2024, 987: 174200.
[33] 唐波, 相利学, 代旭明, 等. 碳纳米管导热复合材料的制备研究进展[J]. 工程塑料应用, 2024, 52(10): 187-192.
TANG B, XIANG L X, DAI X M, et al.Research Progress in the Preparation of Carbon Nanotube Thermally Conductive Composites[J]. Engineering Plastics Application, 2024, 52(10): 187-192.
[34] 董志军, 孙兵, 朱辉, 等. 垂直排列碳纳米管阵列和炭/炭复合材料的制备、导热性能及其在热管理中的应用进展[J]. 新型炭材料, 2021, 36(5): 873-896.
DONG Z J, SUN B, ZHU H, et al.A Review of Aligned Carbon Nanotube Arrays and Carbon/Carbon Composites: Fabrication, Thermal Conduction Properties and Applications in Thermal Management[J]. New Carbon Materials, 2021, 36(5): 873-896.
[35] YU H T, FENG Y Y, CHEN C, et al.Thermally Conductive, Self-Healing, and Elastic Polyimide@Vertically Aligned Carbon Nanotubes Composite as Smart Thermal Interface Material[J]. Carbon, 2021, 179: 348-357.
[36] 罗勇锋. 取向碳纳米管材料的制备方法及应用[D]. 长沙: 中南大学, 2012.
LUO Y F.Application and fabrication of aligned carbon nanotube materials[D]. Changsha: Central South University, 2012.
[37] JIRAN E, THOMPSON C V.Capillary Instabilities in Thin, Continuous Films[J]. Thin Solid Films, 1992, 208(1): 23-28.
[38] 黄三庆. 取向碳纳米管及其复合膜的制备和应用[D]. 上海: 复旦大学, 2012.
HUANG S Q.Preparation and Application of Oriented Carbon Nanotubes and Their Composite Films[D]. Shanghai: Fudan University, 2012.
[39] PEACOCK M A, ROY C K, HAMILTON M C, et al.Characterization of Transferred Vertically Aligned Carbon Nanotubes Arrays as Thermal Interface Materials[J]. International Journal of Heat and Mass Transfer, 2016, 97: 94-100.
[40] HANSSON J, NILSSON T M J, YE L L, et al. Novel Nanostructured Thermal Interface Materials: A Review[J]. International Materials Reviews, 2018, 63(1): 22-45.
[41] TAPHOUSE J H, SMITH O L, MARDER S R, et al.A Pyrenylpropyl Phosphonic Acid Surface Modifier for Mitigating the Thermal Resistance of Carbon Nanotube Contacts[J]. Advanced Functional Materials, 2014, 24(4): 465-471.
[42] QIU L, WANG X T, SU G P, et al.Remarkably Enhanced Thermal Transport Based on a Flexible Horizontally- Aligned Carbon Nanotube Array Film[J]. Scientific Reports, 2016, 6: 21014.
[43] PING L Q, HOU P X, LIU C, et al.Surface-Restrained Growth of Vertically Aligned Carbon Nanotube Arrays with Excellent Thermal Transport Performance[J]. Nanoscale, 2017, 9(24): 8213-8219.
[44] CROSS R, COLA B A, FISHER T, et al.A Metallization and Bonding Approach for High Performance Carbon Nanotube Thermal[J]. Nanotechnology, 2010, 21(44): 445705.
[45] NI Y X, LE KHANH H, CHALOPIN Y, et al.Highly Efficient Thermal Glue for Carbon Nanotubes Based on Azide Polymers[J]. Applied Physics Letters, 2012, 100(19): 193118.
[46] KAUR S, RARAVIKAR N, HELMS B A, et al.Enhanced Thermal Transport at Covalently Functionalized Carbon Nanotube Array Interfaces[J]. Nature Communications, 2014, 5: 3082.
[47] WANG M, LI T T, YAO Y G, et al.Wafer-Scale Transfer of Vertically Aligned Carbon Nanotube Arrays[J]. Journal of the American Chemical Society, 2014, 136(52): 18156-18162.
[48] ZHANG W D, WEN Y, TJIU W C, et al.Growth of Vertically Aligned Carbon-Nanotube Array on Large Area of Quartz Plates by Chemical Vapor Deposition[J]. Applied Physics A, 2002, 74(3): 419-422.
[49] 梁尤轩, 赵斌, 姜川, 等. 垂直碳纳米管阵列的生长控制研究进展[J]. 化工进展, 2014, 33(6): 1491-1497.
LIANG Y X, ZHAO B, JIANG C, et al.Advances in Growth Control of Vertically-Aligned Carbon Nanotube Forests[J]. Chemical Industry and Engineering Progress, 2014, 33(6): 1491-1497.
[50] HUANG H, LIU C H, WU Y, et al.Aligned Carbon Nanotube Composite Films for Thermal Management[J]. Advanced Materials, 2005, 17(13): 1652-1656.
[51] WANG M, CHEN H Y, LIN W, et al.Crack-Free and Scalable Transfer of Carbon Nanotube Arrays into Flexible and Highly Thermal Conductive Composite Film[J]. ACS Applied Materials & Interfaces, 2014, 6(1): 539-544.
[52] MARCONNET A M, YAMAMOTO N, PANZER M A, et al.Thermal Conduction in Aligned Carbon Nanotube- Polymer Nanocomposites with High Packing Density[J]. ACS Nano, 2011, 5(6): 4818-4825.