Analysis of Chip Formation and Evolution Process of SiCp/Al by Pulsed Laser and Ultrasonic Composite Assisted Machining

LIN Jieqiong, XIE Lue, YU Hang, GU Yan, ZHOU Xiaoqin

Surface Technology ›› 2025, Vol. 54 ›› Issue (8) : 167-179.

PDF(40747 KB)
PDF(40747 KB)
Surface Technology ›› 2025, Vol. 54 ›› Issue (8) : 167-179. DOI: 10.16490/j.cnki.issn.1001-3660.2025.08.015
Precision and Ultra-precision Machining

Analysis of Chip Formation and Evolution Process of SiCp/Al by Pulsed Laser and Ultrasonic Composite Assisted Machining

  • LIN Jieqiong1, XIE Lue1, YU Hang1, GU Yan1, ZHOU Xiaoqin2
Author information +
History +

Abstract

SiCp/Al composites stand out from traditional metal materials due to their exceptional physical properties, including ultra-high hardness, high bending strength and a significantly low thermal expansion coefficient. These attributes render them suitable for a broad range of industrial applications that demand performance under extreme conditions. However, the integration of high-strength SiC particles into the SiCp/Al matrix poses significant challenges in processing. Investigating the chip formation during the machining process is instrumental in uncovering the deformation behavior of the material, which can, in turn, enhance tool life and surface quality through the development of effective processing technologies.

Key words

pulse laser and ultrasonic composite assisted machining; SiCp/Al; chip formation mechanism; surface quality

Cite this article

Download Citations
LIN Jieqiong, XIE Lue, YU Hang, GU Yan, ZHOU Xiaoqin. Analysis of Chip Formation and Evolution Process of SiCp/Al by Pulsed Laser and Ultrasonic Composite Assisted Machining[J]. Surface Technology. 2025, 54(8): 167-179
PDF(40747 KB)

Accesses

Citation

Detail

Sections
Recommended

/