Silicon carbide (SiC) ceramics at room temperature or at high temperature can show excellent mechanical properties, such as thermal stability, corrosion resistance, oxidation resistance and high hardness, so it is currently known that the ceramic material has the best high temperature mechanical properties. When compared with electrical discharge machining, electrochemical machining and laser machining, water jet-guided laser offers higher precision and lower thermal damage. As the ablation behavior of water-jet guided laser is complicated, it is necessary to explore the ablation mechanism of SiC water jet-guided laser processing. In this study, the ablation process of SiC water jet-guided laser machining was studied by experiment and simulation, and the ablation threshold, ablation morphology and ablation quality of SiC were investigated and analyzed. The relationship between the ablation power and the ablation diameter of SiC water jet-guided laser machining was obtained. In addition, appropriate increase of laser power could improve the ablation efficiency of the materials, and the SiC ablation quality was the best when the ablation area was close to the laser irradiation area. Non-pressure sintered SiC with a thickness of 1 mm was used as the target material for water jet-guided laser ablation. Single channel groove ablation and drilling were used. The same parameters as used in the experiment were used to simulate the SiC ablation process. The 3D surface morphology of SiC was measured by Bruker Contour GT-K optical microscope, and the SiC multi-pulse ablation threshold under different equivalent pulse numbers was calculated. The relationship between ablation width and ablation depth and laser power and pulse number was obtained, and the effect of laser power on the ablation quality of water jet-guided laser was further revealed. In this study, the ablation threshold of SiC by multi-pulse water jet-guided laser was basically not affected by the number of pulses. The continuous heat transfer of water jet took away the residual heat generated inside the material during the pulse action, the ablation width fluctuated between 3.1-4.1 μm with the number of pulses and the ablation width and depth increased significantly by increasing the laser power. The relationship between ablation diameter and ablation power was fitted, indirectly indicating that the number of pulses was not the main factor affecting the ablation width. Through the analysis of the groove morphology, it was found that the cross section of SiC water jet-guided laser was inverted trapezoidal, the transition between the ablative edge and the unprocessed edge was smooth, and the water jet scouring effect made the bottom basically no melt accumulation, and the side wall formed more banded stripes. The cooling effect of water jet makes the heat accumulation effect of water jet-guided laser processing less. The threshold power of SiC ablated by multi-pulse water-guided laser is 0.156 5 W, which is basically not affected by the number of pulses. The ablation width is mainly affected by the laser power, and the ablation width of SiC can be effectively predicted by laser power. The ablation depth increases with the increase of laser power, and the ablation ability of water jet-guided laser decreases with the increase of laser power. The processing efficiency and processing quality can be effectively improved by reasonably increasing laser power.