With the rapid development of information technology and the rise of the consumer electronic markets, portable flexible electronic devices such as sensors, planar antennas and displays have attracted widespread attentions. Several metals with excellent conductivity and electrochemical activity, including Au, Ag and Cu, have a wide range of applications in the fabrication of these devices. As a kind of metal with high thermal conductivity, outstanding electrical conductivity and relatively low price, copper is an ideal material for making electrodes of electronic components. However, copper electrodes are prone to be oxidized. Compared with other methods of preparing copper microelectrodes, laser direct writing technology has the characteristics of superior efficiency, high precision, and fast sintering speed, thus significantly decreasing the oxygen content of the reduced copper electrodes in the manufacturing process and simplifying the process steps. At present, laser direct writing of copper microelectrodes refers to using laser to irradiate ink, resulting in the thermal decomposition of the reducing agents dissolved in the ink which are sintered together to form a copper electrode.