As a precious metal, gold has stable physical and chemical properties and wide range of applications in industrial and military fields. Therefore, the gold plating layer has good corrosion resistance, oxidation resistance, electrical conductivity and ductility, which is widely used in the manufacturing of precision micro- and nano-components. At present, electrochemical plating is one of the main processes for the realization of gold plating on micro- and nano- components. On the basis of potential or current applying mode, the electrochemical plating can be mainly divided into direct current plating process and pulse plating process. Compared with the direct current plating process, pulse plating process can regulate the electrochemical and concentration polarization of metal ions during electrodeposition process by controlling several pulse parameters, such as pulse waveform, frequency, duty cycle and current density. As a result, the physical and chemical properties of gold plating layer on micro- and nano-components can be flexibly adjusted during the pulse plating process.