Copper is the main material of electronic components, but it is prone to be corroded in the atmospheric environment, especially in the marine atmospheric environment with high humidity and high salinity, which would result in the failure of electronic and electrical devices. When mold grows on the surface of electronic components in the humid environment, the corrosion of cooper becomes more complex, and their coupling mechanism is not clear yet. To study the corrosion behaviour of copper under the action of chloride-containing thin liquid film and molds, a dominant fungus, Aspergillus versicolor, collected in Wenchang, Hainan province was included into solutions containing NaCl with concentration of 0.9wt.% and 3.5wt.% respectively to prepare spore suspensions. Then spore suspensions of different NaCl concentration were evenly sprayed on the surface of copper samples for corrosion tests of constant temperature and humidity. After corrosion tests, the surface of samples was observed by stereological microscope and scanning electron microscope, and corrosion products compositions on the samples surface and inner layer after etching for 15 seconds by argon ion were analyzed by X-ray photoelectron spectroscopy. It was found that copper samples were severely corroded under the thin liquid film containing chloride ions. As the concentration of NaCl in thin liquid film increased from 0.9wt.% to 3.5wt.%, the corrosion products increases significantly and its thickness becomes much larger. It can be found that samples surface and inner layer corrosion products of copper under chloride-containing thin liquid film had a double-layers structure. The inner corrosion products layer closed to the matrix was dense passive film of Cu2O, and the outer corrosion products layer were loose Cu (II) basic salts composed with Cu2(OH)2CO3 and Cu2(OH)3Cl. The corrosion behavior of copper was quite different with or without Aspergillus versicolor. A large number of blue-green Cu (II) basic salts appeared on the surface of sterile samples, while the corrosion products in the presence of Aspergillus versicolor was mainly Cu2O and only a small amount of Cu (II) basic salts were sporadically distributed in the outer layer of Cu2O film. When molds and Chloride ions exist simultaneously, the composition of corrosion products was influenced by the growth activity of molds that was affected by the concentration of NaCl in thin liquid film. Under the simultaneous action of thin liquid film of 0.9wt.% NaCl and fungi, the corrosion products were mainly Cu2O, when the concentration of NaCl in thin liquid film increased to 3.5wt.%, the number of fungi decreased, and Cu (II) basic salts increased compared with 0.9wt.%NaCl experiment group. The results showed that the corrosion products of copper had a double-layers structure with inner Cu2O passive film and outer Cu (II) basic salts, and Aspergillus versicolor affected the concentration of O2 in thin liquid films through respiration, and the affected the type of corrosion products. In the presence of Aspergillus versicolor, Cu (II) basic salts decreased significantly. When the chlorine-containing liquid film is coupled with fungi, the NaCl concentration of the liquid film affected the type of corrosion products by affecting the growth activity of Aspergillus variegatus.