Effects of Screen Printing and Sintering Process on Film Structure and Properties of Ceramic Matrix Composite Microstrip Patch Antenna

CUI Feng-dan, CI Ji-liang, WU Chun-bo, YANG Jing, GAO Wen-bo, ZHANG Jian, LYU Yi, ZHANG Hao

Surface Technology ›› 2022, Vol. 51 ›› Issue (3) : 234-241.

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PDF(3325 KB)
Surface Technology ›› 2022, Vol. 51 ›› Issue (3) : 234-241. DOI: 10.16490/j.cnki.issn.1001-3660.2022.03.025

Effects of Screen Printing and Sintering Process on Film Structure and Properties of Ceramic Matrix Composite Microstrip Patch Antenna

  • CUI Feng-dan1, CI Ji-liang1, YANG Jing1, GAO Wen-bo1, ZHANG Jian1, LYU Yi1, ZHANG Hao1, WU Chun-bo2
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Abstract

The effect of screen printing process parameters (printing pressure, off-screen distance and printing speed) and sintering system (sintering temperature and holding time) on structure and properties of screen-printed silver film on the surface of ceramic matrix composite microstrip patch antenna substrate were studied in this work. The silver film layer was prepared on the surface of the quartz fiber reinforced silica matrix composite material by screen printing process and sintering at a specified temperature. The microscopic morphology, square resistance and adhesion strength of the silver film layer were studied by metallographic microscope, scanning electron microscope, four-point probe tester and welding method, etc. The standing wave performance of the microstrip patch antenna is characterized by the vector network analyzer. When the printing pressure is 90 N, the off-screen distance is 2.5 mm, and the printing speed is 90 mm/s, the square resistance of the silver film layer is the lowest and the adhesion is the largest. The silver film with dense structure and good conductivity can be obtained when the sintering temperature is 850 ℃ and the holding time is 15 min. In above situation, the square resistance of the silver film layer is 5.4 mΩ/□ and the adhesion strength of the silver film layer is 2.25 N/mm2. The antenna plate fabricated under above printing and sintering process conditions has a center frequency of 1.869 GHz at room temperature, which is in good agreement with the design center frequency (1.86 GHz). Screen printing process parameters affect the conductivity and adhesion of the film layer by affecting the transfer rate of silver paste during the printing process. The sintering system profoundly affects the compactness of the silver film structure, which in turn affects the conductivity and adhesion of the silver film. Ceramic matrix composite microstrip patch antenna prepared under the printing pressure of 90 N, the off-screen distance of 2.5 mm, the printing speed of 90 mm/s, sintering temperature of 850 ℃ and holding time of 15 min has good standing wave performance.

Key words

microstrip patch antenna; ceramic matrix composites; screen printing; sintering system; standing wave performance

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CUI Feng-dan, CI Ji-liang, WU Chun-bo, YANG Jing, GAO Wen-bo, ZHANG Jian, LYU Yi, ZHANG Hao. Effects of Screen Printing and Sintering Process on Film Structure and Properties of Ceramic Matrix Composite Microstrip Patch Antenna[J]. Surface Technology. 2022, 51(3): 234-241
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