This paper aims to investigate the influence of environmental factors (temperature) in the process of microbiologically influenced corrosion (MIC), the optimum temperature conditions for bacteria and a preliminary exploration of the MIC mechanism of copper alloys to provide a basis for microbial corrosion and protection. The growth of sulphate-reducing bacteria (SRB) and the corrosion state of copper-nickel surfaces in the medium at different temperatures (25 ℃, 37 ℃ and 45 ℃) were investigated by means of biological analysis, surface analysis and electrochemical testing techniques. Results revealed that the number of SRB cells first increased rapidly during the incubation period and then decreased gradually. The highest number of SRB cells detected and the highest amount of H2S generated in the culture medium were found at 37 ℃. An undense biofilm was generated on the surface of the copper-nickel alloy and pitting pits were detected beneath the biofilm with a small pitting density. The area covered by the biofilm was greatest at 37 ℃ and the greatest average pitting pit depth, approximately 9.3 μm, was detected at this temperature. At all temperatures, the OCP of specimens immersed in biological media moved in a generally positive direction, with the linear polarization resistance (Rp) curve showing a tendency to rise and then fall. At 37 ℃, Rp values detected for specimens were the smallest. The conclusions are drawn from the analysis of the results. Temperature is able to influence the MIC behaviour of copper-nickel alloys caused by SRB. The best growth of SRB and the most severe corrosion of copper-nickel alloys occurs at 37 ℃. The corrosion mechanism of copper-nickel alloys caused by SRB may be both EET-MIC and M-MIC, which may be related to the difference in copper-nickel content.