Analysis of Material Remove Behavior Induced by Rigid Abrasive Particle for Aluminum Substrate on Scratching Based on Atomic Simulation

SHI Yuan-ji, CHENG Cheng, WANG Han-tian, TENG Bing-yan, CHEN Xian-bing, HE Yan-hui, ZHANG Tao, LI Jun-wan, GUO Xun-zhong

Surface Technology ›› 2022, Vol. 51 ›› Issue (1) : 229-239.

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PDF(17451 KB)
Surface Technology ›› 2022, Vol. 51 ›› Issue (1) : 229-239. DOI: 10.16490/j.cnki.issn.1001-3660.2022.01.024

Analysis of Material Remove Behavior Induced by Rigid Abrasive Particle for Aluminum Substrate on Scratching Based on Atomic Simulation

  • SHI Yuan-ji1, CHENG Cheng2, GUO Xun-zhong2, WANG Han-tian3, TENG Bing-yan3, CHEN Xian-bing3, HE Yan-hui3, ZHANG Tao3, LI Jun-wan4
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Abstract

This work aims at Al material removed effectively with some good advantages, such as reduced sub-surface slip and improved surface morphology quality. Thus, molecular dynamics method was applied to investigate the remove behavior of Al material scratched by rigid abrasive particles. Based on EAM and Morse functions, the influence of such crucial factors as abrasive size, temperature, indentation depth, scratching velocity on the remove behavior of Al material was analyzed, thus, the heating source produced by femtosecond laser processing was proposed to improve machined surface quality. It was found that above important factors have obvious influence on remove behavior of Al material, surface morphology quality and sub-surface slip. The scratched surface processed by femtosecond laser will get improved surface morphology quality and reduced sub- surface slip while scratching. At the same time, it shows that it is easier to extrude the wear debris produced to both edges of the groove, resulting in the increase of the wear debris accumulation due to bigger particle size, higher temperature, and larger indentation depth. What is more, the higher scratching velocity is, the scratched surface morphology gets better improvement and the sub-surface slip reduces effectively. Compared with non-laser processing, femtosecond laser processing can not only improve the material removal rate, but also effectively decrease the stress concentration degree and sub-surface slip degree in the contact area between the abrasive particles and the substrate, as well as obviously improve the surface morphology quality of the scratched area. In a word, it is a better strategy to achieve better surface morphology quality and avoid stress concentration through femtosecond laser processing, in connection with the indentation depth, that is, around 10% of the depth size of the assisted heat source area should be taken as the indentation depth.

Key words

sub-surface slip; molecular dynamics; material removal; femtosecond laser processing; single crystal aluminum

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SHI Yuan-ji, CHENG Cheng, WANG Han-tian, TENG Bing-yan, CHEN Xian-bing, HE Yan-hui, ZHANG Tao, LI Jun-wan, GUO Xun-zhong. Analysis of Material Remove Behavior Induced by Rigid Abrasive Particle for Aluminum Substrate on Scratching Based on Atomic Simulation[J]. Surface Technology. 2022, 51(1): 229-239
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