With the rapid development of highly integrated, microelectronic packaging, high power LED and supercomputers technologies, the electronic equipment and circuits characterized with miniaturization, micromation and lightweight lead a trend in modern time and coming days. Therefore, a better performance on heat dissipation is urgently needed. Nowadays, most electronic devices and equipment extract heat through the application of thermally conductive silicone grease, thermally conductive silicone gel and composite materials. If a layer of thermal conductive coating with high thermal conductivity, corrosion resistance and good bond strength is prepared on devices and equipment, it will achieve a better heat dissipation. Starting from the application of high thermal conductivity coatings and its features is explored, and forth three types of high thermal conductivity coatings with different preparation methods and material systems, the research progress of preparing high thermal conductivity coating by spraying technology, magnetron sputtering technology and coatings technology are introduced. Comparing with these thermal conductivity coatings prepared by different techniques, it can be found that the coatings prepared by cold spray technology has a higher thermal conductivity, because the air is a poor conductor of heat, and coatings prepared by cold spraying technology has a low porosity. Furthermore, it will be denser after heat treatment. However, the spraying powder is still conductive. So need to make further study on insulating and high thermal conductivity coatings based on cold spray technology in order to improve the thermal conductivity of devices and equipment.