The purpose is to solve the problem of double-sides processing of ultra-thin sapphire wafers, determine the baseplate materials and the limiter materials of the layer stacked fixture and analyze the failure form of the limiter. By analyzing the stress of workpiece in double-sides machining which used layer stacked fixture and the stress of the workpiece in traditional double-sides machining, we can determine the force of limiter. By measuring the friction between sapphire and the baseplate to choose the material of baseplate, calculate the shear strength of limiter by force analysis and friction coefficient, and preliminarily select the material of limiter. The pressure experiment is carried out on the plane polishing machine to analyze the failure mode of the limiter. The result shows that the force exerted by the stacked fixture on the workpiece in double-sides machining is less than the force received by the planetary gear clamping. Among the three substrate materials, the friction between stainless steel and sapphire wafer is greater, followed by iron, and aluminum alloy is the smallest. The liquid film formed by droplet between the two surfaces has a certain gain effect on the friction coefficient of stainless steel and iron. When the stainless steel material is selected as baseplate, and the glass fiber board material is limiter, processing pressure on the limiter shows a nonlinear increase with the increase of clamping thickness. The main failure mode of limiter is that the limit area is cut by the edge of sapphire wafer, which is affected by the flatness of baseplate and sapphire. Through experimental analysis, it is proved that layer stacked fixtures have lower material strength requirements and more suitable for double-sides machining of ultra-thin plane parts. In order to ensure the clamping strength of the limiter, a better flatness of the baseplate should be selected as much as possible.