The work aims to solve the problems existing in the traditional planar ring polishing process: 1) the polishing fluid is distributed unevenly in the processing area due to the centrifugal force caused by rotating polishing lap and workpiece, resulting in high flatness of workpiece; 2) the centrifugal force acting on the polishing fluid also limits the rotational speed of polishing lap and reduces polishing efficiency. A planar polishing method based on dielectrophoresis effect (DEPP) was proposed: a non-uniform electric field was added to the polishing area, and neutral particles were subject to dielectrophoretic force after being polarized in the non-uniform electric field, so that the neutral particles had the phenomenon of moving towards the center of the electrode and the polishing area, the throwing effect of rotating centrifugal force on polishing fluid was reduced, and high-speed and high-precision polishing of planar workpiece was realized. Finite element analysis software was used to simulate the suppression effect of centrifugal force by dielectrophoretic force on the polarized abrasive particles, optimize the different electrode widths of non-uniform electric field and obtain the optimal parameters of non-uniform electric field electrode distribution. The magnitude and direction of dielectrophoresis force applied to polishing fluid after optimization of electrodes were actually measured. Finally, a test platform was built to verify the effectiveness of dielectrophoresis effect on high-speed polishing planar workpiece. The comparative experiments of polishing ground glass by increasing the rotational speed of polishing lap were as follows: after one hour processing, the grinding layer of glass could be completely removed by dielectrophoresis effect polishing, the workpiece smoothness was good, and the final RMS value was 0.276λ. After polishing without dielectrophoresis effect, the grinding layer of the central part of the workpiece still existed, the workpiece smoothness was poor, and the final RMS value was 0.694λ. By measuring the removal amount, the removal rate of dielectrophoresis polishing was 18% higher than that of polishing without dielectrophoresis. Through simulation and experimental verification, it is proved that the method of high-speed planar polishing by dielectrophoresis effect can effectively improve the polishing efficiency and the workpiece surface flatness by adjusting the electrode layout and optimizing the electrode distribution parameters.