Grinding Thermal Characteristics and Surface Forming Mechanism of Silicon Nitride Ceramics

LI Song-hua, WU Yu-hou, WANG Hao, SUN Jian, WANG He

Surface Technology ›› 2019, Vol. 48 ›› Issue (12) : 360-368.

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Surface Technology ›› 2019, Vol. 48 ›› Issue (12) : 360-368. DOI: 10.16490/j.cnki.issn.1001-3660.2019.12.044
Surface Quality Control and Detection

Grinding Thermal Characteristics and Surface Forming Mechanism of Silicon Nitride Ceramics

  • LI Song-hua1, WU Yu-hou2, WANG He2, WANG Hao3, SUN Jian3
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Abstract

The work aims to investigate the effect of grinding thermal and thermal properties of silicon nitride ceramics on surface formation. Firstly, the heat distribution ratio formula of the incoming workpiece, grinding chip and grinding wheel were obtained by the inverse method. Secondly, the relationship between grinding parameters and grinding temperature and heat distribution ratio were obtained by K-type thermocouple and dynamometer. Finally, the temperature range of the optimal grinding quality was found through the detection of grinding surface morphology and roughness. The results showed that when the grinding wheel speed was increased from 25 m/s to 50 m/s, the grinding temperature was increased from 256 ℃ to 819 ℃ and the heat distribution ratio of the incoming grinding wheel, workpiece and grinding chip were changed from 82.4% to 64.4%, 12.1% to 24.3% and 5.5% to 11.3%. When the grinding depth was increased from 5 μm to 30 μm, the grinding temperature was increased from 289 ℃ to 869 ℃ and the heat distribution ratio of the incoming grinding wheel, workpiece and grinding chip were changed from 76.1% to 53.9%, 17.3% to 30.3% and 6.6% to 15.8%. When the workpiece feed rate was increased from 2000 mm/min to 7000 mm/min, the grinding temperature was reduced from 772 ℃ to 513 ℃ and the heat distribution ratio of the incoming grinding wheel, workpiece and grinding chip were changed from 71.1% to 78.3%, 21.1% to 11.7% and 5.8% to 10.1%. As the grinding temperature increased from 256 ℃ to 869 ℃, the surface roughness first decreased from 0.2708 μm to 0.2472 μm and then increased to 0.3182 μm. Grinding with constant speed ratio could reduce the grinding temperature by 25~127 ℃, and decrease the heat distribution ratio of the incoming workpiece. Proper high temperature is beneficial to the formation of surface plastic deformation and the improvement of surface quality. However, too high temperature will form hot cracks. The surface quality is the best between 489~662 ℃. While the grinding wheel speed increases, the feed rate can be appropriately increased to reduce the grinding temperature, decrease the heat transferred into the workpiece and increase the grinding efficiency.

Key words

heat distribution ratio; grinding temperature; roughness; removal method; crack; constant speed ratio

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LI Song-hua, WU Yu-hou, WANG Hao, SUN Jian, WANG He. Grinding Thermal Characteristics and Surface Forming Mechanism of Silicon Nitride Ceramics[J]. Surface Technology. 2019, 48(12): 360-368

Funding

Supported by the National Natural Science Foundation of China (51675353), Shenyang "Double Hundred Project" Plan (Z18-5-023), Liaoning Province Hundred Million Talents Project Subsidy Plan (2018921009), Shenyang Youth Science and Technology Innovation Talent Support Program (SYSCXRC2017005), Liaoning Natural Science Fund (2019-ZD-0666)
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