The work aims to investigate the time-dependent variation of stress and film/substrate bonding properties of TiN films prepared by high power pulsed magnetron sputtering (HPPMS) during natural aging. TiN thin films with different residual compressive stresses (3.18 and 7.46 GPa) were prepared with high power pulsed magnetron sputtering (HPPMS) by adjusting substrate bias (-50 and -150 V). The time-dependent variation of stress, film/substrate bonding and hardness of the films was evaluated by substrate curvature method, X-ray diffraction method, scratch method and ultra-microhardness tester. Within 1 hour after deposition, the compressive stresses of TiN films prepared under -50 V and -150 V substrate bias pressure fluctuated from 3.12 GPa to 3.39 GPa and 7.40 GPa to 7.5 GPa, respectively. The compressive stresses of TiN films did not change significantly. The average daily decrease was 28.57 MPa and 35.71 MPa for 1~7 days after deposition, 2.08 MPa and 2.50 MPa for 7~30 days and 1.67 MPa and 7.00 MPa for 30~60 days, respectively. The compressive stress decreased continuously, and showed a rapid decline rate in the early stage and a gradual slowdown trend in the later stage. After 60 days of natural placement, the stress was basically released and the film properties remained stable. At the same time, the bonding property of the film/substrate became poor with time and the hardness of the film decreased. The residual stress of TiN films prepared by HPPMS will increase with time and decrease continuously during natural aging, which will affect the mechanical properties of the films.