The work aims to fabricate a binder-less diamond face grinding tool with abrasive particles arranged in order and positive rake angle. A Ti: Sapphire femtosecond laser with a wavelength of 1030 nm and a pulse width of 250 fs was used to ablate and process the SCD. The effects of processing parameters, especially the ablation track pitch on the processing efficiency and surface quality of the diamond, were investigated in advance. Based on the optimal processing parameters, an array of square frustum microabrasive with grain inclination angle of approximately 100° was fabricated on the surface of SCD according to the predesigned laser scanning path. The microabrasive array was subsequently ablated to reduce the inclination angle at the edge of the micro grains below 90°. When the optimal ablation track pitch was determined to be 10.0 μm, the minimum RMS roughness could be achieved on the ablation surface. The laser fabrication process and method of a novel abrasive regularly arranged binder-less diamond face grinding tool with acute inclination angle less than 90° at the edge of the micro grains were elaborated. The fabricated tool showed good surface quality and high profile accuracy and had an average positive rake angle of 9.80°. Femtosecond laser can prepare a new binder-less diamond face grinding tool with abrasive particles arranged in order and positive rake angle efficiently and this kind of tool is expected to reduce the grinding force and enhance the surface integrity of the machined hard and brittle materials.