In order to reduce the adhesive contact failure happens on MEMS products, Some influence factors are considered, including the adhesive force and the elastic-plastic deformation on substrate, and the adhesive contact failures on two body (with different probe radius and cooper substrate) were researched by molecular dynamics method based on embedded atom potentials and verlet algorithms. Furthermore, the center-symmetric parameter are applied to described destruction area and migration path changes at nano-scale. This research works found that the adhesion contact force was not affected by different probe radius before contacting (the displacement ≤1 nm). As probe displacement increased (the displacement ≤1 nm), the curvature radius of diamond have an significance influence on adhesion contact force curve. It also found that the larger diamond probe radius was, the more elastic-plastic deformation intense on cooper substrate, and the contact force versus displacement presents saw tooth situation obviously, which result the substrate was destroyed seriously, so that a large number of atoms were adhered on diamond probe surface, which it means that the adhesive contact failure and adhesion hysteresis phenomenon would happened. This result has important practical significance on researching the mechanism of adhesion contact failures and designing device products surface profile on MEMS products.