The work aims to study corrosion behavior of Cu in Baoji soil under DC interference, discuss effects of soil water content and current density on corrosion behavior of Cu soil, and provide corresponding data support for applicability of Cu grounding materials in different working environment. Corrosion rate of Cu in Baoji soil was tested at different soil water content and under different DC interference conditions by combining rapid evaluation method with coupon zero-gravity test. Corrosion products and morphology were characterized with scanning electron microscope (SEM), laser scanning confocal microscope (LSCM) and Raman spectrum. Corrosion rate of Cu increased as soil water content increased, reached the maximum at the water mass fraction of 25%, and later decreased gradually. Cu was locally corroded in soil medium containing 15% water, and unevenly corroded in the soil medium containing over 20% water. With the increase of DC current density, the corrosion degree of Cu increased gradually, pitting pit density increased gradually and spread more uniformly. However, as the DC current density increased to 3 mA/cm2, the growth of pitting depth gradually decreased, and the pitting pits connected with each other and formed pieces. Provided with lower current density, corrosion products on the Cu sample were Cu2O and Cu2(OH)2CO3. As current density increased, Cu2(OH)2CO3 decreased gradually, and corrosion products were mainly Cu2O and CuO. Soil water content will greatly affect corrosion form and corrosion degree of Cu. The corrosion rate of Cu reaches its maximum as the water content is a critical value. DC interference will promote corrosion of Cu in Baoji soil, and affect composition of the corrosion products.