Due to good conductivity, corrosion resistance and good stability, gold plating is of important application value in semiconductors, integrated circuits, electronic component products, etc. As the importance of gold plating technology on electronic products increases, a lot of studies has been done both at home and abroad to improve stability of gold plating process and plating functionality. Moreover, more thorough work has been done to study gold plating technology in various electronic industry products. Application progress of gold plating and gold plating technology in the electronic and related industries was reviewed from different perspectives. The application of gold plating and plating technology in the field of electronic industry was discussed as well. Technologies of depositing gold plating on different substrates were analyzed (such as fabricating conduction band for thin film substrate, grounding through hole as well as upper and lower interconnected hole for circuit board, bonding points, bonding pads, air bridge, etc.). Main functions of the gold plating (resistance to discoloration and chemical corrosion, low electrical conductivity and contact resistance, high temperature oxidation resistance, welding properties after long-term storage, physical and mechanical properties, etc) were introduced. For the development and demand of promoting gold plating technologies being driven by electron industry modernization, it is proposed that development and application of cyanide-free gold plating technologies as well as subject crossing tend to promote development of gold plating technologies. In addition, contribution of gold plating technologies to technological progress in the field of electronics is affirmed.