The work aims to improve cost performance of LED support, reduce pollution of plating solution for silver plating + pre copper preplating process applied on SPCC steel surface, simplify current nickel preplating-copper plating techniques and improve quality of preplated coating. Technique was simplified by applying HEDP cyanide-free direct copper preplating. Effects of parameters including current density, solution pH, electroplating temperature, HEDP/Cu2+ mole ratio and plating time on coating plating velocity, porosity and surface quality were systematicly studied in the method of single factor experiment, and microstructure and binding force of the coating were also characterized. The preplated copper layer could be obtained at the plating velocity of nearly 1.7 mg/(cm2?min) provided with cathode current density of 1.41 A/dm2, pH 9.5, temperature 50 ℃, HEDP/Cu2+ mole ratio 3.75:1 (Cu2+ 10 g/L) and plating time 11 min. The fully-bright/semi-bright fine-grain and void-free plating exhibited excellent binding force. Compared with steel surface cyanide copper plating and silver plating pre copper plating techniques, the recommended HEDP direct copper preplating technique generates quality coating and meets the requirements of direct copper plating and silver plating copper preplating technique. Meanwhile, this method can effectively reduce pollution of plating solution and simplify plating process, and is of better promotion value for improving copper plating technique of SPCC steel.