The work aims to better understand failure behavior of thermal barrier coating in thermal cycles. Interfacial crack behavior of thermal barrier coating during multiple thermal cycles was studied by introducing cohesive zone model in finite element method. And the effects of ceramic layer thickness and bonding layer thickness on interfacial crack behavior were taken into consideration as well. Crack was first present between crest and trough of ceramic layer/TGO layer interface. Crack was present in trough of the interface. Both average crack length and density increased as the ceramic layer thickness increased as the ceramic layer thickness ranged from 300 μm to 500 μm. The average crack length was 15 μm when the bonding layer was 50 μm thick; it decreased to 10 μm when the bonding layer was 100 μm thick; and increased to 12 μm when the bonding layer was 150 μm thick. The maximum tension stress on ceramic layer/TGO layer interface was the minimum when thickness ratio of the ceramic layer and bonding layer ranged from 0.2 to 0.4, hence the thermal barrier coating had better interfacial crack resistance. The interfacial crack behavior is greatly affected by thickness of ceramic layer and bonding layer, and the interfacial crack resistance will be reduced when the bonding layer is too thick. The calculation results are close that those reported in the literatures, which confirms the accuracy of simulation results.