Although lead-free electroplating has been widely used in electronic industry, the application of lead-free electroplating is still faced with some challenges. Current situation in the field of lead-free electroplating was overviewed, with an emphasis of several popular Sn and Sn alloy lead-free platings and corresponding properties. The lead-free platings currently consisted of pure Sn and Sn alloy systems. The addition of alloying elements had the same effect as that of Pb, i.e., inhibiting presence of tin whiskers. Although various elements had such effects, the lead-free alloy systems now used in electronics electroplating were mainly Sn-Ag, Sn-Cu and Sn-Bi. The application process of lead-free electroplating happened to coincide with densification development of packaging in electronic industry. Thus, many problems associated with lead-free electroplating emerged continuously. A prominent problem was tin whisker. Besides, there were electromigration, void formation at solder joints, interfacial reactions, reflow temperature and cost. Key problems regarding lead-free electroplating were summarized and future development prospect of lead-free electroplating technology were forecasted. There was still no universal lead-free electroplating material that could take the role of Sn-Pb. Therefore, the choice of a lead-free electroplating must be made by manufacturers upon service conditions, cost and application field of electroplate products. In the future, further study shall be performed in respect of lead-free electroplating material, test and technology.